Electronics Forum | Wed May 22 13:07:43 EDT 2002 | melsolutions
Tim, have you considered how efficiency software plays a role in the matrix? Most software from equipment suppliers tends to be programming driven. I have run across a software product from Timms that does an excellent job of controling things lik
Electronics Forum | Thu May 23 03:10:43 EDT 2002 | ianchan
Hi mates, need your advise here. we have solderballs on a model due to neglect by stubborn folks to follow issued process control instructions. the post-reflow PCBA has solderballs stuck in the NC flux residue and is not in compliance to IPC-A-610
Electronics Forum | Thu May 23 11:23:47 EDT 2002 | yngwie
Hi guys... Has anybody hv an experience with using a common or standard profile to reflow high mix brd ( say, low, medium and high )?. The reason for asking is that, we are running high mix low volume, and materials that were consigned is exactly as
Electronics Forum | Tue May 28 09:27:04 EDT 2002 | pjc
Does this PBGA have eutectic balls? If so and the PCB is HASL finish, or has solder on the lands from BGA removal, you may not have to apply solderpaste. Check with you flux supplier to see if they offer a NC "flux paste" product, otherwise I know Mu
Electronics Forum | Thu Jun 06 02:52:42 EDT 2002 | ianchan
Hi mates, just my 2cents worth... some folks (like us) have product runs that have BGA using no-clean, coupled that with Class3 IPC-A-610 specs, topped with aerospace/military customer defined specs. we end up cleaning NC with a degreaser machine w
Electronics Forum | Thu Jun 06 07:28:30 EDT 2002 | cyber_wolf
It has been my experience that the only thing(s) that will ever cause this is: 1. Operators with paste on their hands. 2. Paste on the screen printer tooling. 3. Paste on the bottom of the stencil. Even very very small amounts of paste on the gold fi
Electronics Forum | Thu Jun 06 11:42:24 EDT 2002 | Brad Jakeway
What you are seeing on your gold fingers is referred to as flux spattering. This is a very commond problem with gold fingers if you have a zero flux spattering criteria for quality control. The key to eliminating this problem is in the reflow profi
Electronics Forum | Wed Jun 19 00:07:10 EDT 2002 | kenbliss
arzucom, have you considered using trays to handle your boards in process and your handbuilds. This method is fast becoming the industry standard method for a large variety of reasons, specifically ESD as when the boards are in the tray your people
Electronics Forum | Wed Jun 19 00:07:31 EDT 2002 | kenbliss
arzucom, have you considered using trays to handle your boards in process and your handbuilds. This method is fast becoming the industry standard method for a large variety of reasons, specifically ESD as when the boards are in the tray your people
Electronics Forum | Thu Jun 06 09:45:14 EDT 2002 | Hussman69
We based ours on the type of paste we use (stencil life) and not so much the machine. Then we coupled that to what 'true' conditions we normally see in our plant, and determined that under these conditions Max & min) our printing process should be g
