Electronics Forum | Tue Jun 10 10:58:54 EDT 2003 | Frank
Hi, I currently work on SMT department to uptimize all process. I've just selected the solder paste after testing 15 different products. To be able to do that, I had to create a procedure to evaluate each paste and to be sure that my profil was per
Electronics Forum | Thu May 06 19:56:30 EDT 2004 | bruceatknoll
Here is some more info with regarding my Wave. 1. PCB .065" thick 2. leed length .20" (.135" protrution) I know this is high but we use many thousands and cutting each is not practical. 3. no clean flux by way of foam fluxer 4. wave machine is a HOL
Electronics Forum | Fri May 07 17:38:00 EDT 2004 | bruce @ knoll
I will try that next. I did speed up the wave pump motor with a larger pully(20% more speed) This was done at the time to try to increase the size of the wave because I had component leeds touching the wave pot as they passed by. Due to the wave high
Electronics Forum | Wed Jun 11 12:29:19 EDT 2003 | JB
There are many variables that could cause components to be misplaced. Using the overall tack time reduction is in reality putting a band-aid on a larger problem. Are your small components shifted as well? ( 0402,0805 tec) Components "twisted or off
Electronics Forum | Tue Sep 16 09:02:16 EDT 2003 | Graeme
Murtuza You have recieved loads of good info mainly all the preventive maintenance to be done. But can I ask was all of components placed twisted or just some when machine was run at full tact time 0.12s, I ask this as I run a 4791 and if its only so
Electronics Forum | Wed Jul 30 19:13:29 EDT 2003 | Steve Gregory
Be carefull about thinking that a hot air knife is going to be a cure-all to your problems. They may work in SOME situations. I have an Electrovert Electra that has a hot air knife, and to be perfectly honest, it creates more issues than it solves...
Electronics Forum | Thu Jul 03 07:43:50 EDT 2003 | davef
So, there is a crack or gap between: * Solder and component termination. * Component termination and component body. Correct? Describe: * Coarseness / smoothness of the metal on the termination underneither the crack. * Solder left on the terminatio
Electronics Forum | Fri Jul 04 09:10:53 EDT 2003 | davef
With poorly cured mask: * Wave soldering: Expect to see thin wavy band of dross imbedded in the mask in the wave solder side. * Reflow soldering: Expect to see a pinto board where the two tones of mask are [1] normal color and [2] a lighter color, al
Electronics Forum | Fri Jul 18 22:52:37 EDT 2003 | MA/NY DDave
Hi, I don't know your situation, except for what I have read here on SMTnet, yet what I normally would do, is to do BOTH when it is a long term process control advantage. I would want them to do the analysis and supply me the results and then I wou
Electronics Forum | Mon Jul 28 08:54:52 EDT 2003 | davef
You are 100% correctomundo about ENIG. When it's good it's good, BUT when it's bad, you just want something else. You know you have black pad, when you see parts falling from the board. First, there is not perfect solderability protection. Second
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