Electronics Forum: having (Page 2516 of 3473)

Re: Power component thermal via

Electronics Forum | Wed Feb 02 03:32:08 EST 2000 | pascal MATHIEU

emmanuel : i agree with Dave , it's easy to have blind hole on the bottom side , of course in this case you'll lose some thermal efficiency ;the second solution is to put on the bottom side between the board and your heatsink a soft thermal interfac

Fuji Ip2 macro BGA Placment

Electronics Forum | Fri Jan 28 15:50:22 EST 2000 | Mike Naddra

Is anyone placing 50mil pitch BGA's from a matrix tray, with a Fuji Ip2. The Issue I have is the transfer from the MTU when the part is being transfered for placment it is picked from the tray and then placed on the pneumatically actuated transfer wh

Re: missing component after placement

Electronics Forum | Thu Jan 27 10:22:21 EST 2000 | JAX

Dennis, Not sure why your so secrative about what machine but I guess it doesn't matter. When you start placing 0402 & 0603 packages the difference between height and width and length gets lost in tolerance. This allows the machine to pass parts t

Re: BAS32 diode broken

Electronics Forum | Wed Jan 26 12:22:52 EST 2000 | Mikel Rodriguez

The diode doesn�t appear completely broken. It takes a bit white color (cristal break, I think), instead of the normal red/orange. It works like a 20K-200K ohm resistor. !The diode can be working properly and sometimes change to bad! I think it may

BGA voids

Electronics Forum | Mon Jan 17 13:09:12 EST 2000 | Dennis _F

We seem to have voids show up in one out of 5 BGAs during x-ray inspection. The x-ray is set up to accept the joint with anything less then 30% void area. I need anyones input of what during the process we can do to decrease the voiding and/or a good

Re: SMT Chip terminal lifted

Electronics Forum | Thu Jan 20 11:20:28 EST 2000 | Brian W.

It sounds like what you are seeing is leaching of the end cap. You need to check the manufacturer's spec. Many components have terminal barriers, which get a solder plating. Sometimes this plating process is not done well, and the solder plating le

Re: Mid Chip Solder Balls

Electronics Forum | Fri Jan 14 17:51:37 EST 2000 | Dave F

Dave: Two more things: 1. Let's go backwards, so what changed that suddenly you've realized that "piles of stencils" are causing solder ballig on chips? Are we speeding down the wrong road? Or is this something you lived with and now have decid

Re: GSM feeder question

Electronics Forum | Fri Jan 14 16:22:05 EST 2000 | JAX

The feeders that you are probably refering to are made by hoover-davis. They only have adjustable pitch( electronic ). You probably will not find a universal feeder that has adjustable width. This is because the guide track is positioned on the left

Re: gold fingers over wave

Electronics Forum | Sun Jan 23 03:23:09 EST 2000 | Rob Steltman

Hi We use a U-channel piece of high temperature silicon which is just pushed over the gold tabs before the soldering process. The silicon can be used over and over again. The advantages are that there is no mask on the board during the SMT process a

Re: 100BT

Electronics Forum | Fri Jan 07 19:22:29 EST 2000 | Dave F

100 MHz or Mbps and BT => BaseT => Base Ten. You can purchase interface cards from a variety of sources on the net (www.milestek.com is fairly maroon compliant, which is why I like 'em). In addition to the interface card, each type of point-to-poin


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