Electronics Forum | Mon Feb 03 20:23:48 EST 2003 | davef
Use the pad mating to lead wetting area. Check: * Phil Zarrow's site [ http://www.itmconsulting.org ] for a paper. * Bob Willis may have something on his site [ http://www.bobwillis.co.uk ]. He has been very involved in developing this measure. * F
Electronics Forum | Fri Feb 07 16:10:14 EST 2003 | MA/NY DDave
Hi Gee, It seems funny to comment on your own post. I notice that the original poster and a respondent, like me, are striving to create some voiding by design to improve the way this joint will form. NEAT!! I still think that those vias as DaveF p
Electronics Forum | Tue Feb 04 09:03:45 EST 2003 | Russ Roberts
Greetings, I am pretty new to SMT production, and have learned much from this forum. I am getting ready to build a CCA with many 0402 parts that are really close together. I consider these fine pitch. The board also has two QFPS, so my stencil design
Electronics Forum | Fri Feb 07 09:27:07 EST 2003 | davef
For all of the ranting about "sales-types" using the forum inappropriately, it's nice that some of those types get IT. So if you rant when people behaving poorly, then you must praise people when perform well. This is over-due. Hats off to Mike,
Electronics Forum | Tue Feb 11 11:31:52 EST 2003 | Chad
My small R&D company (15 people) is considering the purchase of a bench top reflow oven & associated gear. The reasoning is that it would be nice to have reflow capability for 5 to 50 piece prototype runs in-house. As the only person with any real kn
Electronics Forum | Wed Feb 12 17:41:18 EST 2003 | MA/NY DDave
Hi, Gee David F is as bad or as good as me on a bad day. Boy can I get mad... "new information" Many of these defects have been around so dang long and seem to get recycled as the latest rage and the newest of new information in technical articles
Electronics Forum | Thu Mar 27 14:09:41 EST 2003 | Enrique Chairez
Hi All, I have observed this problem with one PCB supplier, the portion of the PCB area affected was cut and observed in SEM (Scanning Electron Microscope) and submitted to an EDX (Energy Disperse X ray analysis), finding Phosphorus levels higher
Electronics Forum | Thu Mar 27 14:49:20 EST 2003 | MA/NY DDave
Hi Enrique, I don't remember all the energy levels that make the techniques you or your associates are using, effective. Each energy level yields information that must be understood is the best that I should give. HEY Based on my comment, does this
Electronics Forum | Wed Feb 12 13:45:15 EST 2003 | MA/NY DDave
Hi Good Luck, I worked a long time with THT components like you discuss and boards totally or partially populated. Dee Machines, Electroverts, Hollis and an other and never had the kind of problems you are listing stayed with us forever. I mean you
Electronics Forum | Thu Feb 13 07:13:39 EST 2003 | davef
Tell us more about the location of the bridging [ie, front-to-back, back-to-back, front-to-front, etc]. Thoughts are: * Your annular ring around the hole seems large. You have 0.007", consider 0.003" to be the minimum. Your board fabricator can gi