Electronics Forum | Sun Feb 08 17:30:18 EST 2004 | Hoss
I'm being driven to create a DFM guidelines document to keep our engineering team and customers from running amok. I've conceptualized an outline and basically know what needs to be covered but would like to plagerize all I can (more for photos/diag
Electronics Forum | Wed Feb 11 09:07:37 EST 2004 | Ashok Thiyagarajan
HI I am currently having a wafer which is stud bumped (Au), I am printing conductive adhesives (with silver fillers) on the pads , and by thermocompression bonding, I am establishing the connnection between. But right now the problem is the silver
Electronics Forum | Wed Feb 18 12:42:43 EST 2004 | babe
OK, if the sphere of the ball and the paste on the pad are both eutectic, 63/37 then the paste will reflow first causing a drop of the component, after which the spheres will reflow causing a double drop and a good intermettalic. You can see this by
Electronics Forum | Fri Feb 20 13:25:00 EST 2004 | russ
Help! i just rec'd my next job from our marketing people and it has a .5mm pitch BGA 8mmX8mm size. Along with this kit came the stencil. So, I have never placed this fine of a BGA before and I am pretty worried about the stencil releasing the past
Electronics Forum | Fri Feb 20 15:46:44 EST 2004 | russ
Kinda what I thought, Ken, what would the parameters be relating to sphericity, flux, etc... We use type 3 63/37 usually watersoluble but for this I think I'm gonna have to use no-clean paste. When you say it can be done, what exactly does that
Electronics Forum | Sat Feb 21 11:59:22 EST 2004 | Ken
sphericity and consistency are important. egg shaped, dog-boned shape snd tear-drops work against you and promote clogging and in-effective "transfer efficiency". One of the most signifficant factors will be brand/type. Not all fluxes are created
Electronics Forum | Fri Feb 20 17:04:26 EST 2004 | Long
Hi I am looking for some type of peelable mask or plug to cover the connector during the conformal coating. The problem we have is the moisture get into system and eventually penetrate under the connector creating short circuit to the board. What I r
Electronics Forum | Sun Feb 29 23:15:14 EST 2004 | Ken
I have found that during the interviewing process you need to include your technical staff to get to the nuts-and-bolts of what your looking for. Plus, team involvement spreads the responsibility for selecting the "right" candidate. Recently duri
Electronics Forum | Thu Feb 26 10:27:43 EST 2004 | rob_thomas
We've been using it for a long time to inspect and measure paste height and it works very well.Training the operators is very easy and it is not a time consuming method.We also have an in line automated paste inspection cyberoptics unit and in some i
Electronics Forum | Fri Feb 27 10:12:36 EST 2004 | stefwitt
The front plate of the S15 head gives you access to the signal amplifier boards. You'll find 4 potentiometers adjusting the voltage and the symmetry of track A and B. A digital scope turned to X+Y provides an image of a circle, which is been adjusted
