Electronics Forum: having (Page 2641 of 3473)

Lead Free ...

Electronics Forum | Tue Sep 07 23:57:05 EDT 2004 | KEN

If you want someone to do it for you, hire a consultant. IF you think its going to be handed to you over the web, get real. I don't think coke Inc would be where it is today if it published the formula to coke. For that matter, any CM or OEM would

lead free platings and tin lead

Electronics Forum | Tue Aug 31 19:50:44 EDT 2004 | davef

To take our turn at keeping everyone else on the straight and narrow. For more on lead contamination of no-lead solder, look here: http://www.aimsolder.com/techarticles/Lead%20Contamination%20in%20Lead-Free%20Electronics%20Assembly.pdf [We apolog

Looking for small Dishwasher type cleaning

Electronics Forum | Wed Sep 01 13:42:28 EDT 2004 | cmiller

We use a small DI water generator feeding a diaphram type pressure tank going to a standard dishwasher. We have some filters in-line also to prevent white residue on no-clean boards. I cant think of a good reason to buy a $5,000 board cleaner rather

Looking for Filled via -- Embedded within pad - criteria

Electronics Forum | Thu Sep 02 15:51:15 EDT 2004 | cburress

All: IPC does not directly state any criteria for physical characteristics of what a filled via should look like when embedded within a surface mount component's pad. I am using several of these in my design, and have received PCBs that exhibi

Ion exchanger

Electronics Forum | Thu Sep 02 16:47:08 EDT 2004 | Irun

Hi all I have a question about DI water for cleaning system. What water quality should ionic exchanger produce for assembly cleaning (SMD and THT components with BGA and microwave application). What is recommend water conduction and minimal level (0.

Ion exchanger

Electronics Forum | Thu Sep 02 23:14:33 EDT 2004 | KEN

Not sure of what a bench top DI setup would look like. I use 3.5 Cubic foot tanks but have a special application that uses a 1 cubic foot tanks....even then its not a bench top setup. What is clean. No one can tell you. YOu can use IPC TM650 or t

MLCC crack detection

Electronics Forum | Fri Sep 03 11:45:15 EDT 2004 | rlackey

Hi Ken, I know this doesn't help in the immediate timescale, but isn't avoidance the best form? can you trace the cracking to a process issue (Solder profile, shock damage, handling damage, probe/ATE damage)or a chip cap manufacturing fault? I can'

measument of paste thickness after Screen Printing

Electronics Forum | Wed Sep 08 16:21:41 EDT 2004 | rohman23

I'm in a similar situation. We have a pre-historic semi-automatic printer that does a decent job, but would like to get an automatic printer. I've only just begun looking into the different options available, but would like one that could inspect t

large bga (55mmx44mm) capable placement machines?

Electronics Forum | Wed Sep 08 22:13:07 EDT 2004 | Frank

Our Juki KE-2020 can place up to 74mm X 74mm ICs and BGA. I am have placed this zif socket before on the KE-2020 that you are speaking of. I don't think the KE-2020s are being made any longer. I know the new KE-2060 machines (that replaced the KE-

Wavesoldering Defect

Electronics Forum | Wed Sep 15 05:15:24 EDT 2004 | Adam

I have chceked the fluxing application, I seem to be getting good consistent coverage across the board using our foam fluxing system. Good flux penetration on the top-side of the through-hole plating, as this was checked using a fax paper.There is no


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