Electronics Forum: having (Page 2676 of 3473)

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Electronics Forum | Tue Nov 29 10:32:30 EST 2005 | slthomas

Sure, industrial development is a valid rationalization for theft. :P I'm sorry, but taking money out of someone's pocket to advance your own capability is not justifiable. These guys didn't write these books to give them away any more than Microso

USING LEAD FREE PARTS WITH LEAD PASTE

Electronics Forum | Sat Dec 10 19:10:17 EST 2005 | mika

Most of the chip; res & caps are already lead-free or RoHS compliant and you most certainly already solder them in your regular leaded reflow process. However, there are a few more component packages except from BGA:s that are NOT backwards compatib

USING LEAD FREE PARTS WITH LEAD PASTE

Electronics Forum | Sun Dec 11 20:23:52 EST 2005 | grantp

Hi, As far as I know soldering a lead free BGA in a lead process is similar to soldering down some BGA's such as ceramic that had high temp solder balls. Remember back when a lot of BGA's had hi temp solder balls that also did not collapse during re

USING LEAD FREE PARTS WITH LEAD PASTE

Electronics Forum | Tue Dec 13 12:47:53 EST 2005 | grantp

Hi, No because we don't have the ability to do that, and what is the problem with it? Can you describe what happens and how it's different to soldering a high temp BGA solder ball. My guess is if the solder ball does not melt, then there should be n

USING LEAD FREE PARTS WITH LEAD PASTE

Electronics Forum | Wed Feb 01 17:03:04 EST 2006 | grantp

Hi, What's the difference between soldering a lead free solder ball BGA onto a footprint with lead solder paste when the ball does not collapse, compared to a lead-less package. The BGA is bigger, but you rely on the solder paste only, seems to work

Solder wetting issues

Electronics Forum | Thu Dec 01 14:24:25 EST 2005 | Amol Kane

Hi, I am having a SAC 305 solder paste with water soluble flux wetting issue. during reflow, the solder melts, but doesnt flow. the reflow profile was developed by the solder company person (Kester). the board is a test assembly to validate our LF pr

BGA ball Separation

Electronics Forum | Mon Dec 05 12:57:59 EST 2005 | Billy D

Dude, make sure you're not getting too hot, too quick. If the BGA "dogears" in the oven, or during a rework procedure, it'll either short, or get very strained, depending on which way the part moves, up or down. Also, bake the hell out of them, as if

AOI Machines...........

Electronics Forum | Fri Dec 09 17:37:37 EST 2005 | johnhburris

We have 2 Mirtec machines. The learning curve is steep, but once you get over that the machine is very valuable. I must disagree with the commenter who said the support is poor. While the answers we rcvd differed from person to person at first, Mirte

Lead free compatibility

Electronics Forum | Tue Dec 06 14:30:49 EST 2005 | Samir Nagaheenanajar

I agree with Ken!! Amen to that, brother! At my company here in Rihad, our design guys are in a tizzy about lead free components and tin whiskers, and with every questionable through-hole solder joint, or when our purchasing department gets "notif

SMD acceptable criteria

Electronics Forum | Wed Dec 07 11:56:08 EST 2005 | slthomas

Are you saying you can't send out boards that have been touched up or reworked, or are you saying you can't send out boards with defects on them? 100% is a great goal to shoot for but most people don't expect to achieve it. It all depends on what yo


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