Electronics Forum: having (Page 2931 of 3473)

Re: Solderability of fired-silver/platinum/palladium lead terminations

Electronics Forum | Thu Apr 02 08:26:36 EST 1998 | Steve Gregory

| Yes, norm it is. Look back to February 98 :discussion on this issue. Norm, That discussion does deal with palladium coated leads, but when I read your statement about silver/palladium fired terminations, I'm assuming that you're referring to

Re: Micro Vias in Pads

Electronics Forum | Wed Mar 25 16:38:21 EST 1998 | Steve Joy

We have successfully put .016" vias in .030" pads. There is no issue with .030" solder balls, since the actual volume of the .002" via in pad is small compared to the ball+solder paste volume. We did notice random bubbles where, apparently, the sol

Re: Micro Vias in Pads

Electronics Forum | Wed Mar 25 16:36:10 EST 1998 | Steve Joy

We have successfully put .016" vias in .030" pads. There is no drain off with .030" solder balls, since the actual volume in the .002" depression is low. We did notice random bubbles where, apparently, the solder reflowed and trapped the air in the

Re: In the UK they pay for TV

Electronics Forum | Tue Mar 17 08:25:57 EST 1998 | Jim Gustin

| | Maybe I'm doing something wrong, but it seems to me that The Forum takes a lot longer to open up now. It also takes a lot longer to get back to the main Forum page, after reading an individual message, and hitting the "BACK" button. What's up? I

Re: PCB Warping.

Electronics Forum | Mon Mar 16 18:15:32 EST 1998 | ETS, LLC

Problem occurs because the glass transition temp for FR4 is lower than reflow temperature. Our company wrote an article which was printed in SMT magazine some years ago that deals with this exact subject. Best way to deal with this is to use a center

Re: My 2cents on the new forum layout

Electronics Forum | Tue Mar 10 16:11:16 EST 1998 | Mike

| Hello, | I know nobody asked, but here are my 2cents on the newer, more comercialized layout of the forum. | I frequent many of the SMT/Assembly forums and the ones I prefer to stay with are the ones that are NOT comercially oriented. | Not having

Re: Any help reflow soldering Through Hole parts

Electronics Forum | Fri Mar 06 15:04:11 EST 1998 | Todd N

| We have a double sided pcb that is surface mount on both sides. Now a Through Hole connector has been added. Appart from hand soldering does anyone have info. on reflow soldering the part. The connector is 0.1mm pitch, square legs. | 1) Do you need

Re: Any help reflow soldering Through Hole parts

Electronics Forum | Fri Mar 06 23:02:43 EST 1998 | Scott McKee

| | We have a double sided pcb that is surface mount on both sides. Now a Through Hole connector has been added. Appart from hand soldering does anyone have info. on reflow soldering the part. The connector is 0.1mm pitch, square legs. | | 1) Do you

Re: BGA removal

Electronics Forum | Sat Mar 14 10:16:54 EST 1998 | Clyde F

| | | Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. | | Hi Craig, | | I have been resear

Re: Soldering to Paladium vs. Tin_Lead plated comps

Electronics Forum | Wed Feb 25 12:55:23 EST 1998 | N.J Bateman

| | | I have been involved in SMT for only a few months so I am coming from a position of extreame ignorance. I have been asked to investigate the differences in soldering to components with Paladium coated leads vs the standard Tin_lead. I would


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