Electronics Forum | Sun Jun 23 12:24:37 EDT 2002 | stepheno
I worked at a place where a customer complained that the resistance of some components was lowered. It was found to be flux entrapped from the wave solder process. The tube of epoxy, didn't have a date of manufacture, shelf life, or use by date on
Electronics Forum | Wed Jun 26 09:10:21 EDT 2002 | davef
I want to suggest: * IPC-2221, Generic Standard On Printed Board Design * IPC-222X, Sectional Design Standard For Printed Board For Y Printed Boards ... but I just thumbed through both quickly and saw nothing, I really didn't spend as much time as I
Electronics Forum | Tue Jun 25 15:30:49 EDT 2002 | Steve L
Hi everyone. I am now faced with a problem on soldering PBGA. At first, I ran the board (FR4, 7" X 10" with 12 layer) at Peak Temp: 205 C and 54 seconds above 183 C. After reflow, I found several cold solder joints and one ball without second collaps
Electronics Forum | Wed Jun 26 21:41:46 EDT 2002 | ianchan
Hi mate, "no more than 6hrs in the stencil" for us means: 1) we finish setup of reflow oven, P&P m/c, and lastly the printing machine(includes loading of stencil into printer machine). 2) once printer machine is setup, we rip-open the paste Can pr
Electronics Forum | Fri Jun 28 16:21:03 EDT 2002 | russ
Is that 5 top and 5 bottom zones? We use a 4 zone and a 3/4 zone oven for BGAs and have success. I don't believe that the amount of zones is the issue but what type of profile you can get out of them. I will admit that the large ovens are much eas
Electronics Forum | Thu Jun 27 11:22:03 EDT 2002 | robbied
Hi there. We have had an out of control reflow oven that has allowed its temperature to fluctuate by up to +/- 20 deg C from set point in very short periods of time. We found the root cause of the problem and fixed it, but by then we had already run
Electronics Forum | Mon Jul 01 20:42:54 EDT 2002 | davef
Comments [questions] are: * It�s strange that an uggie ol� SOIC, 50 pitch, BIG honkin� solder pad, kinda thang is failing. Sumpin aint kosher, yano? * Where is the failure occurring [ie, lead to pad, pad to board, etc]? Talk about the breadth and di
Electronics Forum | Wed Jul 03 07:40:48 EDT 2002 | Yannick
Hi, WE are making some test with this kind of component and aperture and here what we think. when you use a home plate aperture it's seem that the component is not lenght enought to have a good solder but maybe is our CAD guy that didn't make a
Electronics Forum | Wed Jul 03 15:58:16 EDT 2002 | davef
Your thinking is correct. Wave soldering pads that were designed for reflow can create problems: * Large pads used for reflow [too much solder] can create reliability problems. * Bridging [too much solder] creates rework. * Skipping & shadowing from
Electronics Forum | Sun Jul 07 20:26:09 EDT 2002 | Dreamsniper
Hi Fastek You don't need compressed air for convection unless that oven comes with some pneumatic system parts (air cylinders, solenoids etc.). Air comes from the Oven Blowers themselves. Some ovens have Baffles, they are metal plates with high numb
