Electronics Forum | Tue Oct 12 09:52:18 EDT 2010 | dyoungquist
Obviously a totally clean floor is the best. So what if you have 1 particle of dust on your entire production floor? Is that 1 part per million (1 PPM)? or is that 1 part per billion? or 1 part per ???? How do you measure dust and come up with a
Electronics Forum | Thu Nov 04 20:49:58 EDT 2010 | eadthem
What software version and build are you using, and were you lucky enough to get a manual for it? How big are your moduals and what is your component density like? Setting up a MV3-L for IPC 3 will take a serious investment in time for a operator wi
Electronics Forum | Thu Oct 21 12:44:07 EDT 2010 | swag
We issue extra parts like this: 8/2 caps and resis. - 40 over 8/4 caps and resis. - 20 over 8/4 IC's - 7 over 12mm - 7 over larger feeders + stick + matrix = the correct # req'd. These #'s were based on our first SMT lines (used equip.) and we made
Electronics Forum | Thu Nov 04 04:27:46 EDT 2010 | d0min0
thanks for all the feedback... we also checked, just in case : - bake the components (no visible improvement) - bake the pcb (50% less tombstone components) - finally we changed LF paste to completely different manufacturer - and booom 0 (zero) tombs
Electronics Forum | Tue Jan 11 13:12:58 EST 2011 | methos1979
Has anyone had any luck programming using the side cameras to inspect for defects on the sides of chip components? We recently had an escape of a damaged chip capacitor that was impossible to see from the top camera but was clearly visible with the
Electronics Forum | Tue Nov 09 04:21:11 EST 2010 | bising
Hi SMT World, I am facing a technical challenge related to an SOIC 14lds with thermal pad on it's belly that needs to be soldered onto PCB, together with leads. It is a 50 per board, expected 80% solder load on every one. We have some units without
Electronics Forum | Fri Nov 19 13:07:01 EST 2010 | vmorina
Hello everyone, Talking to my boss today I was able to determine what we're really looking for in terms of reflow soldering. The company is not looking to do a volume run; we're trying to solder chips for prototype boards, which are currently done w
Electronics Forum | Thu Dec 16 15:06:32 EST 2010 | rway
I would go with AOI. Reasons are: --AOIs are faster --They have more coverage. Given, you cannot test the value of components, but the AOI will ensure that all resistors are correct, orientation of ICs are proper and components are present on the
Electronics Forum | Tue Nov 30 11:42:03 EST 2010 | hegemon
A simple question with very complex answers... But to simplify, you could start at this. Water soluble fluxes are cleaned using (typically) de-ionized water, using a spray wash method. Sometimes a saponifier is added to the water to help it get
Electronics Forum | Mon Dec 20 22:41:42 EST 2010 | grantp
Hi, We had it for a while, but had to take it out and replace it with normal convection. I mean the soldering quality is absolutely amazing, and the joints looked perfect, however it was a horror for tomb-stoning. We tried all types of stencil apert
