Electronics Forum: head and pillow defects (Page 1 of 3)

BGA Head-in-pillow Defects

Electronics Forum | Mon Aug 25 06:43:37 EDT 2008 | callckq

Dear All, Recently, we found a strange defect called "Head-in-pillow" defect at CPU socket BGA. The strange thing here is that this problem only appear on that CPU socket BGA and not on the others BGA which were also mounted on the PCB. We suspect

High complex board manufacturing

Electronics Forum | Mon Mar 02 08:25:08 EST 2009 | jorge_quijano

Thanx for all your recomendations, we already ask for a 3D SPI and help us well, we are asking for a ultrasonic stencil cleaner. By the way how do you deal with the 'head in pillow' defects? is there a solder paste alloy / profile issue?

Mydata Pick and place

Electronics Forum | Tue Aug 28 14:21:39 EDT 2001 | Scott B

You have to be careful here. The figure is expressed as placement accuracy, not process quality therefore 3 sigma does not relate to 2700 PPM defects but 2700 parts per million placed outwith 15microns (0.0006" / 0.6thou). Extrapolating the distribu

Mydata Pick and place

Electronics Forum | Sun Aug 26 12:40:59 EDT 2001 | stefwitt

I would like to enter the discussion by tossing some numbers in. First of all I don�t like the 3 Sigma value. 3 Sigma are 2000 defects per mio. if I remember correctly. This means, if you have 200 components on the board, then every 10 boards have on

BGA Head-in-pillow Defects

Electronics Forum | Tue Aug 26 09:33:04 EDT 2008 | wavemasterlarry

If this board is waved soldered than you may want to look at the wave causing the BGA to reflow a 2nd time when it goes over the wave. The board bows down and the the joint liquidfies and then hardens before the board fully goes back to flat which c

Re: Paladium Pillows and Bad Dreams

Electronics Forum | Wed Feb 25 01:24:34 EST 1998 | Steve Gregory

Dave, I confess I was a tad too general and a bit too extreme describing the way ALL solder joints look on palladium coated leads. I should been more specific about the "pillow-effect". I've seen it regularly with palladium coated leads on small SOT

Low Silver Solder Problems

Electronics Forum | Wed Aug 26 05:13:01 EDT 2009 | grahamcooper22

Hi, as you are using Vapour phase reflow what temperature is the boiling point of the solvent you are using ? If it is @ 250 C then you should be getting everything hot enough to melt the ball and solder paste together. If this is the case then your

BGA Placement Process

Electronics Forum | Fri Mar 26 03:25:02 EDT 2010 | grahamcooper22

HI, regarding the baking....why are you doing it every 72 hours ? How many times has each device been baked ? If you are worried about moisture in the devices the best policy is to store them correctly in dry packs or dry cabinets or bake them once j

BGA opens

Electronics Forum | Tue Jan 23 10:22:27 EST 2007 | Peter W.

Hello, maybe you are experiencing the so called "head in pillow" defect. It is especially critical for larger BGA. The defect comes from the deformation during reflow of the BGA, so that some of the balls are lifted and have no contact during liquid

BGA Head-in-pillow Defects

Electronics Forum | Mon Aug 25 08:26:33 EDT 2008 | scottp

We've gone through this a couple times. Once it was because the device was warping in reflow. We confirmed with shadow moire that the corners were lifting up. The supplier fixed some things in their molding process to reduce the warpage. Another

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