Electronics Forum | Wed Oct 03 17:10:32 EDT 2001 | davef
Your component is probably EPTSSOP [Exposed Pad Thin Shrink Small Outline Package]. We had a thread on EPTSSOP a couple of months ago. [Check the fine SMTnet Archives for background.] You�re correct that voids in the solder on the exposed pad [rea
Electronics Forum | Sat Aug 22 16:07:31 EDT 1998 | Manuel Cornejo
| | Require a conductive adhesive - either isotropic or anisotrpic - which can be used for 100micron oitch devices. | | Must be resistant to solvents such as MEK and acetone. | | Cure below 150C, with possible potential for rework of the conections.
Electronics Forum | Tue Jul 28 17:37:00 EDT 1998 | Robert Steltman
| Here is what I would do faced with your problem. First I would profile a similar board or use an existing profile. From there I would place the dummy device on the surface of a sample board with a thin thermocouple soldered to the board surface und
Electronics Forum | Mon Jun 01 17:41:59 EDT 1998 | Jim Hoxie
First of all let me say that we are currently placing other 240 pin QFP'S with no problem. But none of them have the MASS of this beast. The part is a XILINX XC5215-6HQ240C which has a large metal heat sink covering most of the bottom of the part. T
Electronics Forum | Tue Jun 02 16:02:13 EDT 1998 | Earl Moon
| First of all let me say that we are currently placing other 240 pin QFP'S with no problem. But none of them have the MASS of this beast. | The part is a XILINX XC5215-6HQ240C which has a large metal heat sink covering most of the bottom of the part
Electronics Forum | Tue Jun 02 08:30:30 EDT 1998 | Jon Medernach
I have to agree with Steve. If the problem is progessively worse the problem is the pitch conversion that was used, and I have seen it before. It may be masked by the solder paste which could be on pitch but after reflow the paste wickes to the pad
Electronics Forum | Mon May 11 17:35:01 EDT 1998 | Steve Gregory
On 11 May, 1998 Todd wrote: | We are having continuous bridging problems with the trailing | leads on a 26-pin D-sub through-hole connector. The pitch is | 0.100". The connector is going through the wave at approximately | a 20 Degree angle. Does
Electronics Forum | Wed May 06 15:05:00 EDT 1998 | Justin Medernach
| | Dear Freinds, | | DOES ANY ONE OF YOU WILL BE KIND ENOUGH TO GIVE SOME INPUT ON DOUBLE SIDE REFLOW OF COMPONENTS WHAT ABOUT BOTTOM SIDE COMPONENT HOLDING DURING 2ND SIDE REFLOW? ANY IDEA OTHER THAN USING SLDERPASTE WITH OFFSET MELTING POINT, EPOX
Electronics Forum | Tue Apr 14 09:01:36 EDT 1998 | Justin Medernach
| We are having some difficulty soldering a 240 pin Altera device. We use Alpha WS-609, a very generic profile for that solder paste, and a 6 mil stencil with laser cut apertures (1:1 ratio). This is a 20 mil pitch device (aperture size is 10 mils X
Electronics Forum | Wed Jun 23 12:25:13 EDT 2004 | Cal
JD- I have used a few of GlenBrook's machines.. Jewel Box 70, Jewel Box 90, and RTX-113. Currently we have the RTX -113 on our shop floor as we speak. I like the machine but wished I would have went for for the angle viewing option or even the BGA so