Electronics Forum: heated (Page 126 of 301)

Lead free selective solder

Electronics Forum | Fri Jun 23 12:54:53 EDT 2017 | guts1872

We are having issues with top fill and dropping pins on Molex connectors with our KISS 101. Unfortunately we do not have a pre heater and bottom side pre heat with our nozzles is not satisfactory. Most of the issues occur when using a no clean proces

Thermal Pads Soldering Worry, can anybody help?

Electronics Forum | Thu Jul 20 23:41:55 EDT 2017 | heros_electronics

Below is an email that I copy and pasted from my customer's engineer about his concerns with the issue of the chips not reflowing (which is why I was asking about X-ray the chips to make sure they reflowed): Can you let me know your thoughts on his

LED sticking into carrier tape

Electronics Forum | Wed Aug 02 05:27:00 EDT 2017 | tmennink

We did this test, we opened the tape and turned it upside down, indeed some leds were staying inside the tape. We will try placing them next week with a fuji NXT line. We also contacted the manufacturer, apparently heat perhaps during transport coul

Dimensional Stability

Electronics Forum | Thu Aug 03 10:12:31 EDT 2017 | bspoon

DCS testing has detected exotherming in samples of stock FR4 laminate material. The exotherming subsequently disappears from the heat flow plots when DSC testing is repeated a second time on the same samples. Can this non/ under-cured material cause

Component Drop on Second side of the reflow

Electronics Forum | Mon Aug 14 03:38:37 EDT 2017 | spoiltforchoice

The pads in the datasheet should suffice. The TDK part really isn't all that big but its reflow profile indicates it is not exactly the most tolerant device with regards to heat. 245C for 5s is not a lot, I would check very carefully that your profil

Solder Paste for Thermal Cycling application (-40 to 150 Degree Celcius)

Electronics Forum | Sat Aug 03 03:28:16 EDT 2019 | alexeyzb

We use SNPb for such applications (PCBA for aircraft). We tried SAC305 but recieve no good quality, so now only SNPb. If you will find good solution - please write. Because now we have some problems with BGA - no SNPb balls. And need to reball (addit

Yellow dust inside HEATING CONVECTOR

Electronics Forum | Wed Feb 07 07:55:45 EST 2018 | paulocabaca60

Hi Recently have several components inside the machine covered with this yellow dust. It is visible that some components are almost obstructed after a week working. We never seen this kind of dirt inside the machines, and we don’t know the origin o

Yellow dust inside HEATING CONVECTOR

Electronics Forum | Thu Feb 15 08:00:35 EST 2018 | cbart

Hi many thanks for your help, I mean reflow > oven. Ok, yes, it sounds like the debris that builds up on fans/heaters/ducting may be making its way onto you product. if the exhaust fan that vents your machine failed this could be the cause, or it

DDR3 - BGA VDD and VDDQ Pins - Design Guidelines

Electronics Forum | Mon Apr 09 02:57:16 EDT 2018 | robl

Hi, these are both power pins, usually connected to a dedicated inner VDD/VDDQ 1oz copper layer, making a very effective heatsink. I am guessing that not enough heat got to the ball to fully melt it, creating a weaker column rather than a beautifull

Ceramic PCB Challenge

Electronics Forum | Wed Jul 18 21:38:34 EDT 2018 | davef

Reflow temperature recipe: Keep ramp rates below 1.5 deg. c/second. Ceramic is such a good heat sink you will need a slow profile by today's standards. Handling: Do not drop ceramic boards Handling: Wear gloves ceramic can be very sharp General: T


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