Electronics Forum: heated (Page 291 of 301)

Re: Cleaning procedures for Entek-Plus Cu-106A

Electronics Forum | Tue Apr 20 22:09:03 EDT 1999 | Earl Moon

| | I am wondering if anyone has any info regarding solder paste misprint clean-up procedures for Entek Plus CU-106A PCB's utilizing a water-clean solder paste. In a implementation procedure they recommend a 2-3 minute wash cycle with the following

Re: BGA repair/rework

Electronics Forum | Mon Mar 08 23:43:54 EST 1999 | Dean

> Alignment issues are not so critical on most any system, but thermal >>(top and bottom heater settings) certainly are. Without a serious >>system, I just don't see how it can be done. | | | | Thanks again Earl for your valuable communications..

Re: White layer appearance on PCB

Electronics Forum | Thu Jan 28 16:29:03 EST 1999 | Tom B

Okay, Another question, if the soldermask in not cured, then it is washed will water ingress (from wash or ambient ) play havoc with capacitance or dielectric of PCB. I mean will my crystal and clock circuits start "Y2K'n" on me. OR will my PCB go

Re: White layer appearance on PCB

Electronics Forum | Thu Jan 28 17:31:20 EST 1999 | Earl Moon

| | | Hello Netters, | | | | | | I need some info, Earl or Dave, I have a PCB that exhibits a white layer on solder side. It does not appear to be surface residues (IPA has no effect), but looks like its under solder mask. My first guess is that t

Re: White layer appearance on PCB

Electronics Forum | Sun Jan 31 03:28:24 EST 1999 | Jeff Sanchez

| Hello Netters, | | I need some info, Earl or Dave, I have a PCB that exhibits a white layer on solder side. It does not appear to be surface residues (IPA has no effect), but looks like its under solder mask. My first guess is that the LPI solde

Re: white residue

Electronics Forum | Fri Jan 29 05:14:06 EST 1999 | Graham Naisbitt

Hi guys, I really am at a loss to understand this one. It would appear that there may be some reaction between the flux and the resist? Or maybe you have an OSP on the board that is reacting during soldering? As a fast fix, maybe you should try a

Re: Too hot to handle

Electronics Forum | Fri Jan 29 07:55:52 EST 1999 | Wayne Bracy

| | | | | | Greetings, | | | | | | | | | | | | Can anyone tell me what temperatures pcb's should have when coming out of a forced convection reflow oven and out of a wavesoldering machine. | | | | | | Also, is there any danger of the pcb's giving of

Re: CSP Assembly- No-clean vs Aqueous

Electronics Forum | Tue Dec 29 22:31:06 EST 1998 | Kelvin Chow

It is still a big concern on using No-clean or aqueous cleaning for CSP assembly. I prefer to use no-clean, however, not all components are suitable to use it. Especially those dirty capacitors or connectors which may cause solderability problem. It

Re: CSP Assembly- No-clean vs Aqueous

Electronics Forum | Wed Dec 30 17:34:23 EST 1998 | Michael Allen

I'm afraid we don't agree regarding the best test method to use here. My understanding is as follows. The omegameter test measures board-level, ionic contamination (i.e., average for the entire board area and all components); it does not tell you w

Re: No Clean in High Frequency Apps

Electronics Forum | Wed Dec 09 10:02:10 EST 1998 | Earl Moon

| Does anybody out there have any special insights into utilizing no clean paste in high frequency RF applications? I would imagine there may be some issues with solder balls that would affect functional test (Earl, do you have something for me here?


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