Electronics Forum | Wed Jun 13 17:50:06 EDT 2001 | deonn
Igmar, Have had similar problems in the past caused by different factors. The first obvious area to check is in your pick and place machine. Too much force in the Z-Direction may cause micro-cracks, which are not apparent, until the board is proces
Electronics Forum | Wed Jun 13 17:50:28 EDT 2001 | deonn
Igmar, Have had similar problems in the past caused by different factors. The first obvious area to check is in your pick and place machine. Too much force in the Z-Direction may cause micro-cracks, which are not apparent, until the board is proces
Electronics Forum | Thu Jun 14 14:01:11 EDT 2001 | Claude_Couture
I used to associate the mass of the assembly with the reflow profile. The greater the mass, the greater the quantity of heat you need to give the assembly. Most of the time you just need to reduce the speed of travel in the oven. Try different settin
Electronics Forum | Tue Jun 19 10:59:21 EDT 2001 | Gil Zweig
When x-ray inspecting BGA packages with metal heat spreaders tube voltages greater than those used for Plastic BGAs must be used. It must be recognized, however, that the tube votage required will depend on the particular sensitivity of the x-ray cam
Electronics Forum | Fri Jun 29 18:43:16 EDT 2001 | procon
Dear Danial, The only stupid thought is the one left only as a thought and not asked. The size of the board and the placement of the BGA on the board could play a big factor during reflow. If you are processing boards on an edge conveyor and the boa
Electronics Forum | Mon Jun 25 10:35:39 EDT 2001 | rkevin
Despite all my efforts I cannot eliminate icycling on my t/h leads. They come and go.... daily, lots of rework. I have eliminated the following from the scenrio: Inadequate flux to promote quick drainage, Pot temperature too low, Soldering surface
Electronics Forum | Thu Jul 12 16:18:24 EDT 2001 | caldon
I am not familiar with the ERSA system you talk about but wanted to let you know there is another company call PDR that also uses IR and no nozzles. the machine is pretty slick and easy to use and set up. We have found no adverse affects to the IR he
Electronics Forum | Wed Aug 15 18:16:15 EDT 2001 | Shindler
Hi Larry- Be wary of which IR systems you use, dark IR (ERSA) maintains only the positive effects of infrared use in that this infrared medium wavelength has the optimal absorbtion/reflection ratio between light and dark colors. Therby, guaranteeing
Electronics Forum | Fri Jul 13 08:25:03 EDT 2001 | caldon
You will need to prepare the component and site for rework. Using solder wick remove the solder from the pad site and the component balls. You can also use a heated Vacuum desoldering tool. To reball we have been using Winslow Automation reballing ki
Electronics Forum | Wed Aug 01 11:11:38 EDT 2001 | JohnW
hi Folk's, Ok so I'm looking for some thoughts on Conductive Epoxy's. I'm trying to replace a material that i can place between a QFP and the PCB to transfer heat from the component to the PCB. The material has to be able to be injected thro' a hole
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