Electronics Forum | Mon Jul 28 14:30:22 EDT 2008 | grics
Take a look at this. Remember, these are only guidlines and can not replace any paste specs. As Real Chunks said, a profiler will be of HUGE help. We use this to determine what our top side temps are and to see if we have any problems with heat sen
Electronics Forum | Fri Aug 01 00:40:06 EDT 2008 | roc2x
thanks,my pad design is 24 x 23 mils and now I chnged my stencil to 24 x 20 mils ship inwrds to lower down my volume. My placement is and part data are ok. My reflow N2 is using 1000ppm, Actual is 700-800ppm I already prolonged my pre-heat butit only
Electronics Forum | Wed Aug 27 17:12:34 EDT 2008 | mikesewell
Silicone contamination could appear as fisheyes or dark spots under UV light. 1A33 can be heat cured but is a single component oxygen cure coating - it needs a source of oxygen to cure. An unvented oven may slow or limit the cure. Check out the TDS
Electronics Forum | Sat Oct 18 20:35:25 EDT 2008 | arosario
I see, maybe changing my peak temp in reflow will help. I'll try do eval again... Actually, once I did have evaluated a longer pre-heat but on my previous eval, I didn't change the peak temp. Maybe reflow can help compensate to my problem in the part
Electronics Forum | Wed Nov 12 13:00:58 EST 2008 | cisridn
I have to build test fixtures for RF Power transistors. These components generate alot of heat so the PCB is soldered to a baseplate. The problem I am having is that I am getting too much solder flowing thru the via's and flooding the topside of th
Electronics Forum | Thu Nov 27 10:55:51 EST 2008 | muarty
Hi Steve, Are you actually profiling the BGA itself? By that I mean have you, for example, drilled through the underside of the pcb into the balls of the BGA and attached a probe there? You may find that even although the topside components have a p
Electronics Forum | Wed Dec 10 09:29:59 EST 2008 | rgduval
Oops...just noticed you were referring to wave soldering. We'd still suggest a water-soluble flux, instead of the no-clean; especially at wave soldering. Also, checking pre-heat temps, and dwell time on the pot. Is the wave a chipper wave? If not
Electronics Forum | Tue Feb 03 03:57:37 EST 2009 | sachu_70
Hi George, I would suggest you to re-look your process parameters, especially for the pre-heat temperatures and the amount of flux deposited. The mask properties and that of your flux also play a role, but you could zero down to the root cause after
Electronics Forum | Mon Feb 23 05:37:23 EST 2009 | emmanueldavid
Necoleta, PWB Blistering/De-lamination may not be due for Titanium finished threads / holders which is typically being used to draw high Shelf Life of Pallets and even flow across Auto Wave Soldering rails. There is also nothing to suspect on Liquid
Electronics Forum | Fri Feb 20 12:04:29 EST 2009 | markhoch
Okay, after taking an actual minute to think about my suggestion, it has dawned on me that filling a metal cavity with molten solder to make a solder connection is not a good idea. By doing so I wouldn't be giving the metal cavity sufficient time to
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