Electronics Forum | Wed Mar 15 04:36:16 EDT 2017 | Rob
@ Sr.Tech, Any voiding means that the part of the package under the void is not forming a solid thermal interface with the PCB, therefore it's heatsinking capability is reduced. With the drive for smaller packages with higher power handling capabil
Electronics Forum | Wed Mar 15 09:53:58 EDT 2017 | rob
Hi Etimov, Understood that to us assembling parts that IPC is king, however it isn't neccesarily the bible for design engineers. We've had customers demand almost zero voiding, or had to use conductive epoxy to avoid it. For some of us solder joi
Electronics Forum | Wed Mar 15 10:21:08 EDT 2017 | pzappella
Hello Rob, I totally agree with you. Is this a real problem that is being shoved under the rug or just whatever voiding we get from a belt furnace is good enough. I think vacuum reflow can do much better but is a batch approach and not contin
Electronics Forum | Fri Mar 31 13:59:21 EDT 2017 | westshoredesign
Need more information. BUT if your strictly considering just the paste change. I would imagine your changeover would be little to no different than changing to the second board if you were using the same paste. Maybe take extra care cleaning your sq
Electronics Forum | Wed Jun 21 12:33:39 EDT 2017 | sumote
I agree that a preheater would be a good thing to try. Before you buy one, try heating your boards up in an oven, then putting them on your machine. Any oven will do, just make sure you leave them in long enough to get a good thermal soak. Also, as
Electronics Forum | Thu Aug 10 11:24:18 EDT 2017 | dleeper
The exposed metallization on the sides of the QFN probably aren't tinned and therefore not expected to have solder wetted to them. If previous parts formed nice toe filets, it might just be that those parts were fresher and the exposed metal did not
Electronics Forum | Sat Aug 12 11:55:52 EDT 2017 | sankarseptember
We are facing component Drop on second side of the reflow.We are using Senju Reflow oven..Profile judgement was within in the standard.All the component Drop occur in between last heating zone and cooling Zone.The dropped component is ICC 525FL5 SOP
Electronics Forum | Wed Sep 20 00:31:32 EDT 2017 | v037022
Dear, Now we have some problems related to flux inside Reflow oven (Tamura oven, 7 zones). Flux drop on PCB so much. It has 2 kind of flux: wet and dry. We did maintenance cleanly reflow oven but it still happen. We are planning to test new setting o
Electronics Forum | Mon Dec 04 08:43:39 EST 2017 | bandjwet
If you are looking to rework (after all of the previous suggestions are taken and tried....you have some solid ones in there). When a device like this is placed and is hard to get to we use the 7721 bumping process using a controlled heat source (no
Electronics Forum | Wed Dec 06 09:09:54 EST 2017 | davef
Suppliers have improved the utility and quality of OSP [organic solderability preservative] solderable surface protection over the years. Be cautious reading too much into older SMTnet [and web in general] conversations about handling OSP. When prop
