Electronics Forum: heating (Page 211 of 301)

BTU profile

Electronics Forum | Tue Aug 13 13:46:54 EDT 2002 | soupatech

Hello again.... I have been reading up on profiles and how to set them up for different results. I now have an upcomming job with some strict guidlines on reflow. I was wondering... if I were to email a pic of my desired profile could someone out the

Aqueous cleaner water disposal

Electronics Forum | Mon Sep 09 19:17:56 EDT 2002 | dragonslayr

steve- once again I mention that the lead that is actually in the water is in solution i.e. the lead is in a molecular form that has attached to a H2O molecule. To have a minimum of lead that is below the regulated ppm, there cannot be any chunks,

cleaning NO clean

Electronics Forum | Tue Sep 17 15:59:48 EDT 2002 | Randy V

No-Clean fluxes are difficult to clean off boards. Cleaning effectivness depends on the washer, the chemistry, the flux type, number of reflows, and the time between reflow and washing. White residue is flux residues that have started to break down b

through hole reflow

Electronics Forum | Tue Oct 01 16:18:16 EDT 2002 | davef

Q1: Is this [paste in hole] feasible? A1: Yes, many people lower their operating cost by reflowing through hole components. Q2: What types of components are difficult to do this way [paste in hole]? A2: Types of through hole components that are d

Connector solderability

Electronics Forum | Tue Nov 05 18:17:00 EST 2002 | russ

This sounds like a contamination issue with the HASL finish.(solder on lead but not on pad). I have experienced this before and it was related to the HASL process at our supplier. They found some type of contaminate in the bath (unfortunately I can

Connector solderability

Electronics Forum | Wed Nov 06 10:31:30 EST 2002 | davef

First, from what you say, it's unclear that there is a "solderability" issue with your connectors. Different appearance of the soldered connection from one side of the connector to the other is what we're talking about [I think]. But it is curious.

Connector solderability

Electronics Forum | Wed Nov 06 14:57:56 EST 2002 | rmorford

Nothing funny seems to happen to the connector when heated. I have no idea how to monitor the temperature of a good pad vs. a bad pad because I have no idea before reflow which ones will be good and which will be bad. I did take a board and rip the

Immersion Silver

Electronics Forum | Wed Nov 06 20:18:30 EST 2002 | davef

cvrgrrrl Your first thermal cycle with imm silver should be the easiest to solder. That you see copper indicates you did no soldering, got no wetting, produced no intermetallics, etc. Tell us again which components did not solder? Wuzzis "plug" t

piercing of test vias at ICT

Electronics Forum | Fri Nov 15 15:02:37 EST 2002 | MA/NY DDave

OK I know it is funny to have two different PWB/PCB processes, one for pre production and one post production yet it is possible if controlled and implemented in a strategy. In debug if your company's experience has been for a repeated need to do IC

Voids in every Lead-free BGA solder Joint

Electronics Forum | Thu Nov 21 06:36:30 EST 2002 | Ben

I'm doing SMT of lead-free solder BGA on FR4 Ni-Au PCB. The solder paste I'm using is Sn/Ag/Cu and reflow with peak temp at 240C. I found there are voids(1-2) in almost every solder joint(500 micron in dia) under xray. And the void size is violate th


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