Electronics Forum | Mon Jun 19 19:08:21 EDT 2000 | Brian W.
IPC-610 Rev B: Paragraph 4.1 (page 52), As an exception to fil requirements on Table 4-1 on thermal heat sink planes plated through holes, a 50% vertical fill of solder is permitted, but with solder extending 360 degrees around the lead with 100% wet
Electronics Forum | Wed Feb 16 05:00:50 EST 2000 | Dean
What is the package type? TO92, TO5...etc. This temp. sensing device clips (mechanically) to the sink. And this requires a special tool? How about thermo bond heat sink compound? "output" by loc tite is the only flavor I can think of...There a
Electronics Forum | Wed Sep 20 10:42:05 EDT 2000 | Erick Russell
Process control for Photonic soldering is based on the actual temperature of the component being reworked. If the desired temperature of the component for your process is 200C then that is the process temperature programmed. This is achieved by a cl
Electronics Forum | Tue Jun 12 20:36:00 EDT 2001 | ianchan
Hi mates, thanks for the interest on this topic, just to share info to clarify any queries : 1) am using light blue-grey materials for the Pallet 2) am using Hot Air Convection Reflow Oven 3) I suspect its due to the Pallet materials properties, t
Electronics Forum | Thu Feb 03 20:45:28 EST 2000 | Gary
I have worked with the PDR type rework station on and off for 12 years and have found that the IR can offer a lot of advantages over hot air. As was mentioned the lack of nozzels is a great advantage. The back heater takes a while to warm up but on
Electronics Forum | Sat Jan 29 13:06:18 EST 2000 | Graham Naisbitt
Todd, All liquid coatings are Newtonian - they follow gravity so they do indeed run away from sharp leads and edges. Silicones are generally worse because they have very low surface energy - although this is an asset when trying to get under compone
Electronics Forum | Wed Aug 25 07:53:08 EDT 1999 | Scott Davies
| | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | Any help would be appreciated. Thanks. | | | Most common reason is uneven heating where one side of the com
Electronics Forum | Wed Aug 25 09:48:28 EDT 1999 | Larry Koens
| | | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | | | Any help would be appreciated. Thanks. | | | | | Most common reason is uneven heating where one side
Electronics Forum | Mon May 24 10:17:54 EDT 1999 | john thorup
| Can anyone steer me towards a supplier of heatsinks suitable for use on a PQFP 160. Before you shoot me down in flames, I know that I am not going to get much heat away from the die because of the plastic but the application is such that the board
Electronics Forum | Tue May 11 12:02:03 EDT 1999 | Tony
| We are currently looking at purchasing some BGA rework equipment. Could someone give us the pro's and cons of IR heating (top/bottom)vs. hot air convection ? | All other tips are also welcome. | | Thanks | Philip, I have been doing BGA rework for