Electronics Forum | Fri Jul 26 18:28:51 EDT 2002 | blnorman
Actually this is for an automotive instrument cluster. From what I've been told back in the good old days we switched fluxes and after the car sat in the sun (and heat) a haze developed on the inside of the panel that was attributed to the flux.
Electronics Forum | Thu Aug 22 15:31:52 EDT 2002 | Claude_Couture
In an oven with flux reclamation system, once the circulation is prevented by accumulation of flux in the heat exchanger, the flux will condense where it can, and some of it will coat your PCBs with a uniform layer of flux on the parts/ joints/ goldf
Electronics Forum | Fri Aug 23 22:26:48 EDT 2002 | caldon
If you really want to monitor manual soldering.....Dwell time, heat tip,........ Contact ACI as they have a process tool the goes inline with you soldering iron for real time SPC data. Contact Jeff Staong at aci 610-362-1200 x 224 or jstong@aciusa.o
Electronics Forum | Fri Oct 25 04:06:56 EDT 2002 | kcngoi
Hi Adam, Excessive heat from soldering iron will left the burn mark of RMA flux. The residue is hard to remove. Suggest to use the Flux pen for better control.
Electronics Forum | Tue Nov 12 13:11:40 EST 2002 | steve
Your heating temperature is too low. Check your process and run the board through again. Then the graininess problem should go away. Or, try some different solder.
Electronics Forum | Mon Nov 25 13:00:12 EST 2002 | steve
Ersa is the choice for lower end repair and rework systems. Airvac is the choice for higher end systems. Stay away from low end hot air units. They typically do not present an even flow of heat across the component. The Ersa requires no nozzles, whic
Electronics Forum | Mon Dec 16 19:05:57 EST 2002 | davidduke
Steve , I agree with all the responses you have received. Randy Villeneuve is absolutly correct in all of his assesments and I would consider him an expert with the process , Gris is correct about adding a "heat sink" to the process complicating pr
Electronics Forum | Tue Dec 17 18:37:18 EST 2002 | davef
As a starting point, consider that these component leads may not be getting hot enough. Measure the temperature profile on the leads that do not solder well to be sure: * Heating and cooling ramps are within the paste supplier's recommendations. * C
Electronics Forum | Tue Jan 28 17:23:11 EST 2003 | C. M. Gabel
I am working with a BGA package. The laminate layer is being modeled as BT-Cu smear. The thermal conductivity of BT is 0.19 W/mK. Does anyone know what the density and specific heat values are for BT?
Electronics Forum | Tue Jan 28 17:28:02 EST 2003 | C. M. Gabel
I am working with a BGA package. The laminate layer is being modeled as BT-Cu smear. The thermal conductivity of BT is 0.19 W/mK. Does anyone know what the density and specific heat values are for BT?
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