Electronics Forum | Mon Sep 22 15:32:20 EDT 2008 | davef
We see this fairly often. It doesn't affect solderability. Our analysis makes us think this coloration is copper. The reason copper appears on the surface may be that heat cycles increase the thinness and porosity of the immersion silver [IAg] coatin
Electronics Forum | Tue Oct 21 14:15:05 EDT 2008 | ccouture
Mariss, I would run a power analyser on your oven to see the real power consumption during warm-up and during production. Then you would be better able to decide how much money to invest in a humidity controled cabinet big enough to contain your dail
Electronics Forum | Thu Oct 16 11:15:53 EDT 2008 | davef
A good solder connection with heavy ground plane requires: * Plenty of heat [Is the preheater located too far from the wave? Whenever you look at board temperature, there is a sharp decrease in temperature between the preheater and the wave.] * Conta
Electronics Forum | Wed Feb 04 10:24:05 EST 2009 | dyoungquist
We use SN100C in our selective solder process. The 3 keys to proper hole fill are applying a proper amount of flux, heating of the pcb and solder temperature. If either the pcb or solder is not hot enough, you may not get good hole fill. To adjus
Electronics Forum | Tue Mar 24 09:04:33 EDT 2009 | sachu_70
External CO2 extinguishers certainly help. But requires the alertness of a trained personnel to use the same effectively during a fire. I have also come across a solution wherein the extinguisher is kept always connected to continuously deliver pres
Electronics Forum | Wed Apr 29 10:08:52 EDT 2009 | wavemasterlarry
I like to cook my lunch thru the ovens on 2nd shift. just heat it up more than anything else - but it works. I think if you just get the right heat into the food it will kill the bacteria. Now I prefer convection over IR. Call me old fasioned, bu
Electronics Forum | Fri May 22 15:37:23 EDT 2009 | 1smtdude
Depending on the material chosen, it's possible to �rework� underfilled components. However, it's far from a production process. Two steps are usually required. First: remove the package from the PCB. Second: remove the residual underfill from the P
Electronics Forum | Wed Dec 23 09:11:56 EST 2009 | lynn_norman
In a former life, we used hi temp solder. I've heard of adhesive and taping methods, we just never used them. We too had a "golden" assembly that we would use for routine profiling. Our requirement was to attach a TC to the lowest thermal mass, hi
Electronics Forum | Wed Jan 27 11:58:35 EST 2010 | randyw
Our products are a mixed technology; with both surface mount components solder side and through-hole top side, in addition to massive heat sink assemblies. We have been using your SN100C solder in our wave solder process with Multicore MFR301 Flux si
Electronics Forum | Mon Apr 19 11:04:21 EDT 2010 | baildl632
We have had some unusual reflow conditions with BGA's as well. We did not come to the conclusion that something was covering the lands though. It typically occured with only the BGA lands (not the decoupling caps on the back side). We found that the
.gif)
