Electronics Forum | Tue Jun 06 20:13:31 EDT 2000 | Dave F
Not as easy as that Bob. But this may help you get started ... IC packaging materials include: � Silicone - Room temperature vulcanized silicone - Heat curable hydrosilation silicone � Biphenol & multifunctional epoxy glob tops � Polyurethane � Pol
Electronics Forum | Wed May 24 17:09:05 EDT 2000 | Chris McDonald
We have A V-Tek using pressure sensitive cover tape but the only success that we have found is with SO-8, S0-14, SO-16 anything wider and the tape pulls apart when on our feeders. ANything over 16 wide is not recommened unless you get a heat sensitiv
Electronics Forum | Thu Oct 11 13:37:35 EDT 2001 | Stefan
The pressure sensitive tape is used as an alternative to heat sealed cover tape. It works usually quite well and is easily applied by the taping machine, but it can create some problems in the tape feeder. In the Surftape, Cal is referring to, the c
Electronics Forum | Thu Mar 16 07:02:38 EST 2000 | Scott Davies
Does anybody have any experience or knowledge of processing PCB assemblies featuring pyroelectric sensor devices, the type used in Passive Infra-Red Sensor modules? Since these devices are, by definition, very sensitive to heat, how do you get round
Electronics Forum | Mon Mar 20 08:50:47 EST 2000 | Dave F
Scott: Pyros don't like to be heated, so soldering should be done as quickly as possible. Other tips are: * Keep pyro leads long. * Apply solder to the ends of leads. * Heatsink the lead, while soldering by holding the lead with a pair of pliers
Electronics Forum | Sat Feb 26 09:22:19 EST 2000 | Dave F
Jason: Assuming you wantto reuse the TSOPs, two things come to mind: 1 Don't bend the leads. This can be caused by not melting the solder on all leads at the same time. 2 Don't break the body. This can be caused by moisure absorbed by the case ex
Electronics Forum | Mon Feb 28 17:16:38 EST 2000 | Stu Leech
We just got a lesson on the effectiveness of heat sealed metalized vapor barrier bags. A customer sent us two bags of 100% saturated PBG components by air freight. This was for a demoisturizing test. When we found the devices 80% dry when they arrive
Electronics Forum | Tue Feb 22 04:29:29 EST 2000 | Gwen Z
First I apologize for my poor English writing. we have no heat sink fins and active cooling with power module. when the board is transported,the vibration of board and power module will shotten the solder joint lifetime. if we just solder it withou
Electronics Forum | Wed Jan 17 20:33:19 EST 2001 | davef
The corner balls are supposed to collapse, but at roughly the same time as the other balls collapse. Also, those balls are located in the place that isthe easiest to get hot. Think about cranking-up the bottom heat, waiting, and slowing down the pr
Electronics Forum | Thu Mar 08 22:24:45 EST 2001 | davef
Sounds like you've done a good job of troubleshooting. Two thoughts are: 1 An alternative to using a hotter flux that the others mentioned is to use components with more solderable terminations. [A firm grasp on the obvious.] 2 You spoke about
