Electronics Forum | Mon May 07 10:42:09 EDT 2012 | saju86ece
Hi, I need one clarification about solder paste printing height tolerance. How to define and fix the solder paste height tolerance after screen printing for inspection purpose. Currently we are using 5mils thickness of stencil, in that we are gave
Electronics Forum | Mon May 07 16:07:05 EDT 2012 | davef
Start with targets based on the stencil thickness (for height) and stencil thickness times the aperture size (for volume). * Set reasonable upper and lower control limits (+ 25% and –25 % of the targets, for example). * Next, check the printer set-u
Electronics Forum | Tue Apr 16 01:42:15 EDT 2019 | ledze91
Hello. Got problems with big elements like connectors. Pickup tolerance dont work on cp40/Lv. Here got two machines cp40/lv and one cp40/cv. On cv dont have problems with pickup, but on Lv nozzle hit the pins of connectors or wont pick up
Electronics Forum | Wed Jun 07 22:33:50 EDT 2006 | Bolos
first: what is your problem after reflow? second: a good rule of thumb is a tolerance of 1 mil. for example..if you got 5 thou stencil thickness then your range of thickness is 6-/+1 thou.. then you just improve after you get your height data and ana
Electronics Forum | Wed Jan 08 08:20:52 EST 2014 | emeto
To most of our boards I give 20-30% tolerance in both directions. From experience if you have big aperture on your stencil, the squeegee will scoop certain amount of paste from this aperture and you will see lower height. Depending on your board supp
Electronics Forum | Tue Jan 07 23:38:08 EST 2014 | m_imtiaz
want to know the tolerance the paste height in the solder paste printing. for example if stencil thickness is 7 mil, what will the acceptance level of paste height ( upper and lower) kindly share if any guidelines or formula for the same
Electronics Forum | Mon Feb 21 02:02:54 EST 2005 | JSS
First of all THANKS for thr reply. I totally agree with u that paste dried,stencil aperture clogged like probs comes during the production but we hv a visual inspection stage (with 5X illuminated lamp)after printing process and before inserting the
Electronics Forum | Sat Apr 25 19:40:01 EDT 1998 | Stan Traxler
| We have to mount our SMD devices 0.1 to 0.4 mm off the pcb | PCb substrate to compensate for thermal stressing in a | Space enviroment. Has any one any ideas or contacts for | dissolvable pads. this only applies to leadless components We have appl
Electronics Forum | Thu Mar 17 09:56:34 EST 2005 | jmedernach
Tx, Your spec limit is the point at which you expect to see a failure. In other words, what is the probability that you'll see a short when you have .008" of solder paste? What is the probability that you'll see an open if you have .004" of solder
Electronics Forum | Mon Sep 26 18:53:30 EDT 2016 | chabscan
Could it be possible in my Quad 4c, to increase component size tolerance to reduce the rejection of components? Could this have an impact in the event of the machine picking a component off center? As in if the machine picks a compnent off center but
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