Electronics Forum | Sun Oct 30 00:54:07 EDT 2005 | Mika
Hello mr. vickt. I do not buy your sales argument, despite it sounds like a good bargain for UIC. The truth is that every new machine/option newer worked from the beginning (this goes for every vendor/manufactory). The costs for dealing with the "so
Electronics Forum | Mon Oct 31 14:57:30 EST 2005 | gregp
Hello Rob, So glad you thought of me... Contact Systems policy is--and always has been--free software upgrades for the life of the machine. We do not differentiate betweeen "bug" fixes and added features. Each release is a combination of the two al
Electronics Forum | Wed Nov 02 01:30:12 EST 2005 | fctassembly
Hello Arnold, Yes, by definition of joint formation, copper will dissolve in lead free solder in order to form the connecting intermetallic layer. There is a distinct difference in the copper dissolution rates of the major alloys being considered wi
Electronics Forum | Thu Nov 03 08:18:17 EST 2005 | fctassembly
Hello Arnold, Just to clarify the Sn100C discussion: Please note that SN100C is the Nihon Superior alloy composed of tin/.7copper/nickel. The key point in regard to SN100C is that Cu does not go directly into solution but first reacts to form an inte
Electronics Forum | Thu Dec 15 23:04:07 EST 2005 | Manyhats
Hello, we are a low volume high mixed CM looking for a new addition to our SMT depot. We are currently running 2 Mydata TP-11 Hydra and feel that this can not meet our 06' forcast and current builds. I need to make a decision whether to go with the S
Electronics Forum | Wed Dec 21 12:12:44 EST 2005 | mmjm_1099
Hello all, I am a contract manufacturer and I got handed the project of looking up our parts and seeing what's lead-free and what's not. Well my question would be how is your purchasing dept handling this. I would like some input on this from alot of
Electronics Forum | Thu Dec 29 03:57:16 EST 2005 | sparrow
Hello Chris, To be honest, it's hard to believe you could not bond to ENIG at all. Yes, the gold layer is thin and hard, but it just narrows the process window and does not make the bonding impossible. I say this, because we have been using TS gold w
Electronics Forum | Wed Feb 08 04:08:35 EST 2006 | fctassembly
Hello Greg, I agree with you that the article in SMT Magazine should be studied very carefully as it contains many errors in respect to SN100C. The testing performed was a DOE and was not an optimized run. There is also a statement on dross generatio
Electronics Forum | Mon Feb 13 10:33:57 EST 2006 | fredericksr
Hello, I am automating a process on our floor from wire solder hand application to dispensed paste and reflow. The process involves "lidding" a shielding lid around our assemblies for microwave quieting. The result is non-hermetic. For cosmet
Electronics Forum | Thu Mar 02 05:07:51 EST 2006 | pavel
We have bought an old zevatech 730 in Bosch auction (hello MikeZIG). There seems to be something wrong with the X axis servo, the machine is vibrating when the head is moving fast (in fact the machine is dancing, in the race with washing machine it w