Electronics Forum | Mon Oct 24 16:24:53 EDT 2011 | smdbert
Hello, My name is Bert i'm working by LéTÉ with two mydata smd machines and have sometimes several problems ,most of the problems try to solve it by myself but sometimes the boss also helps and i write the errors in map but first of all 4 questions
Electronics Forum | Fri Nov 04 22:03:35 EDT 2011 | machinehead
Yeah that is a drawback to those feeders. The > plastic part that is mentioned in one of the > responses is okay but you have to be real careful > when pulling the tape out before you can put that > part on. Mydata always says to leave the reel
Electronics Forum | Mon Nov 14 00:13:55 EST 2011 | tpappano
Hi Jeff, I pulled the proms from both machines, copied to disk, re-burned the the old versions with the newer and reinstalled. The ram became scrambled in the upgraded unit on startup, but I did a full restore through the serial port and unit #2 got
Electronics Forum | Wed Nov 16 18:20:39 EST 2011 | dontfeedphils
According to the message guide it just says that it's a error telling you to initiate the Hydra Theta axis. I suppose the encoder for the hydra theta motor could be losing count and causing it to need to be re-initiated, or it could be something to
Electronics Forum | Mon Jun 25 16:16:01 EDT 2012 | rway
I have some suggestions. We have been fighting bad fids for years. Some things we have tried that have helped is: 1) Look at your relief area around your fid. Does it butt up against the solder mask. We allow 20 mil around the fid as a relief ar
Electronics Forum | Thu Jun 21 16:30:47 EDT 2012 | grauen06
We are currently using an ACE K.I.S.S. 104. We used SN100 solder with AIM NC265 flux (no clean, alcohol-based). Also, we use topside preheat at 100 degrees C and a 6mm nozzle (as big as we can go with this application). The PCB has a matte finish as
Electronics Forum | Thu Oct 25 13:35:47 EDT 2012 | davef
Here's a paper that may help http://www.ipcoutlook.org/pdf/assembly_challenges_bottom_terminated_ipc.pdf Temperature Impact * Profile didn’t have a significant impact on voiding. * Voids slightly increased with higher temperature. Reflow Atmosp
Electronics Forum | Tue Oct 16 01:29:11 EDT 2012 | dman97
I have a very odd problem with my Fuji IP3 and was wondering if anyone can help. Any part that gets picked from the MTU will fail vision recognition. After turning on the vision trace data, I can see that the IP3 is looking for the part to be rotat
Electronics Forum | Wed Dec 12 16:12:58 EST 2012 | tombstonesmt
Glad to hear we have more Jade users on the forum! What kind of flux footprint is your fluxer leaving on the board? You called it a "spray" fluxer.. We use the MIC fluxer that functions like a jet fluxer. Do you flux each individual lead or do a
Electronics Forum | Fri Feb 01 19:07:57 EST 2013 | hegemon
We have had some success in void reduction with LGA by pre-tinning or "bumping" the devices before placement. The extra solder seems to allow a slightly higher standoff, and allows better outgassing, is my guess. A lot more labor , but the results
