Electronics Forum | Wed Jul 12 01:48:45 EDT 2000 | Zhang JianJun
There are two kinds of automatic inspection equipment was used in our company in China. One is MVT GS-1 another one is VI2000. We put it in line before reflow oven for quality control. It's very useful and average 1-2 DPHU reduction compare with non
Electronics Forum | Fri May 30 01:40:32 EDT 2003 | Narong tungthongchai
Dear Zhang JianJun My company just bought in two MVT GS-1 by auction. Unfortunately, there is no technical manual or reference document. I appreciate your help to make a copy of manual for me. Please let me know the cost of them.
Electronics Forum | Tue Jul 11 11:35:03 EDT 2000 | genglish
John, Dave. The adhesive deposition is on the second pass through the SMT area, the PTH components have previously been fitted during the axial / radial stages of manufacture. The stencil is 2mm thick with a 1.5 mm routing depth. the leads (cut & cl
Electronics Forum | Thu Jul 06 19:41:31 EDT 2000 | Hermie
We recently installed a new Servo-Amp which controls the X-Y table on our CP6 machine. Eversince, we are experiencing a Cycle alarm X-reach on the machine. We tried to greased the table a little bit more but the only thing that seems to work is to sl
Electronics Forum | Tue Jun 27 11:16:33 EDT 2000 | Christopher Lampron
Hello Bill, Ioan's idea's are good. One more thing that you may want to consider is using a "Home Plate" aperture on your stencil for the aforementioned caps. The idea is to put a smaller amount of solder paste directly underneath the component. This
Electronics Forum | Mon Jun 26 12:39:48 EDT 2000 | Matt McKinley
My facility is getting swamped with new products. We are spending a LOT of time doing PDs. We generally use calipers for this operation. I understand Fuji has a PD developer tool that helps automate PD generation. Has anyone had any luck with thi
Electronics Forum | Mon Jun 26 11:35:23 EDT 2000 | Christopher Lampron
Hello, We have had some problems with electrical testing of molded electrolytic and tant caps on our Mydata machines. It appears that the components will test backwards on a polarized cap test. The Mydata uses the rise time to determine polarity. Doe
Electronics Forum | Wed Jun 28 07:45:39 EDT 2000 | Wolfgang Busko
Hi Allan, I can�t help with literature on that topic but we have great success with solder thiefs to prevent bridging with 2mm pitch THT-connector. We added just blind pads of the same size at the end of each row similar to what you can do with SMD
Electronics Forum | Thu Jun 22 10:27:26 EDT 2000 | Igmar
Can someone please help with the aperture size on a Micro BGA stencil. I want to have an electroformed stencil made with 0.1mm (4mil) thickness. The PCB pad for the micro BGA has a 0.406mm (16mil) diameter. What size should I make the apertures for t
Electronics Forum | Thu Jun 22 09:31:21 EDT 2000 | Rich Ziebell
All, Can anyone point me in the right direction for (sources of info) various ways to quickly cure RTV or atleast speed up the process. Our requirements are to use Dow Corning 3145 hi-temp RTV. I have tried contacting the manufacturer but am losing
