Electronics Forum | Thu Feb 25 10:17:44 EST 1999 | Joe Cameron
I second Dave's encouragement to use the archives. It's a wealth of info and the search engine usually get's me what I want the first time. By the way, Richard, are you soldering your thermocouple to a ball on the BGA with hi-temp solder? It'd hel
Electronics Forum | Sat Feb 20 09:56:22 EST 1999 | Tufty
| We are in the process of getting into no-clean paste and fluxes. One important issue in this is sodler balling. I have heard some people say that having a matte finish would help in having lesser solder balls and that the solder balls would not b
Electronics Forum | Fri Feb 19 02:11:11 EST 1999 | Pete Sorenson
| During inspection and test we find leads which do not get soldered. Some are because of insufficient paste, but with others everything looks right. This will only happen on 1 to 2 pins, and it is not isolated to a specific type of ic or location o
Electronics Forum | Fri Feb 19 09:29:38 EST 1999 | Justin Medernach
| What to look for that causes tombstoning and the corective action. | The three biggest causes that I can think of are placement machine component picking inaccuracy, placing inaccuracy, and design design design. If your placement platform is pic
Electronics Forum | Tue Feb 16 19:31:46 EST 1999 | Earl Moon
| We appear to receive certain standard discrete components (1206,0805,&0603)that deviate in size and shape to the extent that vision processing discard rates are through the roof. Does anyone else have problems with vendors being unable to produce
Electronics Forum | Thu Feb 18 17:06:33 EST 1999 | Dave Jurena
| Hope some of you out there can help me with this one. | I am getting feedback from our test department that they are showing opens on solder joints which have visually good wetting. The touch-up operators confirm that the joint looks good. All they
Electronics Forum | Fri Feb 12 18:48:19 EST 1999 | Jon Medernach
Bill, You should wipe clean. The thin layer will dry out quickly and cause other problems. Remember squeegee down stop and squeegee pressure are seperate issues. If your downstop is to low the stencil and board will flex down, after the squeegee p
Electronics Forum | Sat Feb 13 07:57:42 EST 1999 | Kelly
| I am fairly new to the SMT game and I am getting conflicting answers to the following. Maybe someone can help me! When printing, one person is telling me that the stencil should be wiped completely clean of all paste because the quality of the
Electronics Forum | Tue Feb 16 08:54:57 EST 1999 | Ross Berntson
| I am fairly new to the SMT game and I am getting conflicting answers to the following. Maybe someone can help me! When printing, one person is telling me that the stencil should be wiped completely clean of all paste because the quality of the
Electronics Forum | Tue Feb 09 11:44:31 EST 1999 | john
| Hi. | I'm trying to looking for a manner to enlagre the solder tip life. I have heard about some chemicals substances that | help both avoid or eliminate oxidation on tips. | Anybody can suggest me some of those products | Thanks in advance | Mario