Electronics Forum | Wed Jan 02 12:11:32 EST 2002 | mparker
Ian is correct in saying that the Cert.s and x-section should be forwarded to QA. It would be the responsibility of Incoming or Receiving Inspection to validate the materials. Your suppliers are offering proof that they comply to industry standards o
Electronics Forum | Tue Jan 15 06:05:37 EST 2002 | Romain
Dear all We have since few weeks problems with BGA solder joint integrity on ENIG finish. Under relatively very flexible of the FR4, the joint breaks between ball and PWB. When we take off the BGA for analysis, some of the pads seem very flat, totaly
Electronics Forum | Wed Jan 16 07:49:14 EST 2002 | Yannick
Hi, In few weeks I want to test the capabilities of our SMT Line. To do that I'll design a board. I want to test: - The Printing - The component placement - The soldering - Different stencil aperture - Mixed Technology (Thr
Electronics Forum | Mon Jan 21 15:55:53 EST 2002 | Yannick
The point behind traces and vias on my test is that I don't only want to perform test on printing and placement but on reflow too, so a board with many components and no trace will not react like a board with traces on it. Unless you or someone else
Electronics Forum | Thu Jan 17 20:33:05 EST 2002 | ianchan
Hi, Can anyone help explain the benefits/disadvantages of bareboard pcb baking, as part of the pre-heat conditioning, before the bareboard pcb use in SMT production run? The pcb board is 200mm x 240mm panelized pcb board, and has 28 smaller pcb boa
Electronics Forum | Thu Jan 24 16:17:31 EST 2002 | mzaboogie
I have recently been asked to look into some problems that we are having at wave. It is common for us to have unsoldered joints for boards that have SMT parts epoxied to the bottom side. Recently we have had a problem with a gold plated board. The wa
Electronics Forum | Wed Feb 13 09:49:30 EST 2002 | Phil the Quality Guy
Basically, the charge curve of a nicad cell isn't particularly linear. Your length of time is more dependant on the amperage rating of your cell. There's a difference between a 1.4 Amp and a 2.2 Amp capacity. As a nicad charges the bulk of the cha
Electronics Forum | Tue Jan 29 20:13:30 EST 2002 | davef
Over-time lead separates from the tin in solder by force of nature [diffusion], but I assume that is not what you are talking about. Please help us understand your question better. Are you saying that the solder does not attach properly to the comp
Electronics Forum | Wed Jan 30 08:30:33 EST 2002 | seto
Hello Dave, Mechanically the conection between the component pad and PCB pad is good (the solder joint is very strong). The problem is associated with poor contact after the use by the customer (vibration, temperature, etc). You can see the pictures
Electronics Forum | Fri Feb 01 06:15:46 EST 2002 | nifhail
This can be a solution for IC/BGA soldering for lead-free process isn't it ? See, most of the reflow profile set meets solder paste specification but often violating ICs or BGA requirement. Most of the solder paste required temperature of about 205 -