Electronics Forum | Wed Jan 09 01:22:39 EST 2019 | kenneth0
Hi Simond, The baking process is likely to remove any moisture after the cleaning process. We wouldn't want any moisture trapped as this might cause delamination if the package is subject to subsequent heating/reflow process. Hence there's a staging
Electronics Forum | Mon Sep 01 10:42:43 EDT 2014 | spoiltforchoice
Saw one for sale recently, even the broker didn't seem sure about this information, hence it was cheap.
Electronics Forum | Sun Sep 19 19:51:31 EDT 2004 | aaronrobinson
thanks for your reply ....yes the air is then able to hold more water vapour.... but so is the component hence there is no water vapour pressure difference and the component and the air in the oven would still be in equilibrium???? hence no effective
Electronics Forum | Mon Apr 03 10:18:50 EDT 2006 | amol_kane
Hi Smartasp, would you mind giving the name/ more info of the company you work for? (this is not related to the post and hence we can take it offline if you want). my e-mail address is amol_kane@hotmail.com I am originally from India, and hence inte
Electronics Forum | Tue May 29 15:00:15 EDT 2001 | surteess
Sorry guys but you missed the point - I am looking at thicknesses for SPRING contacts - such as the ones used in the telephone plugs that fit into the wall socket, I cannot find a telecom standard - hence thought some PCBers might be able to shine a
Electronics Forum | Mon Jun 11 21:27:43 EDT 2001 | procon
Way to go CPI! This is a classic example of design. Many people experience this when the have an 0402 close to a QFP or other large components. The pad closest to the larger component will become liquidous later than the pad farthest. Hence, a new t
Electronics Forum | Mon Aug 12 16:54:37 EDT 2002 | sasharm2
We are getting broken traces in PCBAs, any idea why. In addition, only few of the boards show this problem, hence I don't think it is an issue with the board manufacturer. thanks, SS
Electronics Forum | Fri Jan 31 14:35:48 EST 2003 | russ
I would go for the laminar flow as opposed to N2. The contour nozzle doesn't really work all that well even with N2. I knew I should of asked you if you had a contour, I was thinking laminar flow hence the dynamics input. Russ
Electronics Forum | Fri Aug 06 08:36:06 EDT 2004 | vinitverma
Do you mean to say that the turrets can compensate for the height? I thought it was purely a mechanical up-down movement with the cam and hence the thickness hardly has any effect!
Electronics Forum | Thu Jan 26 15:51:06 EST 2006 | tzawaide
We're currently using adhesive-type board cleaners (TekNek), and they've been more troublesome than anything. They cause a lot of hangups, and hence causing m/c crashes, etc. Any recommendations on PCB cleaners that can be integrated into the prod
