Electronics Forum | Tue Jul 25 13:40:04 EDT 2017 | davegoad
I have some CERSOT-23 transistor packages with castellated terminals. The 4th lead (drain castellation) is electrically connected to the top of the device by the castellation. The castellation goes up the ceramic body and contacts the metal package
Electronics Forum | Wed Apr 15 09:59:56 EDT 1998 | Miangui Xue
I have a hermetic package with 1 atm of Helium (5% vol.) and Argon (95%) inside. We have detected the helium leaks at 5*e-8 ccatm/sec. My question is what is the leaking rate of argon. Can anybody provide any insight or information to calculate the r
Electronics Forum | Fri Nov 19 11:07:17 EST 1999 | Bob Smith
Hi John, I don't know of any posters etc. but specs. are available free on-line at www.jedec.com for classification, time out of packaging before baking is required, bake times & temperatures. My understanding is that it only causes a problem if th
Electronics Forum | Wed Oct 23 15:33:38 EDT 2002 | Randy V.
Dye penetrant is a liguid that will wick through very small cracks. I used over 10 years ago for checking cracks in glass feedthru's in hermetic packages. You put the dye on one side of the seal and developer (white) on the other side and the red dye
Electronics Forum | Thu Sep 08 07:04:02 EDT 2005 | davef
Finer pitch: Wedge bonding can be designed and manufactured to very small dimensions, down to 50 mm pitch. Processing speed: Machine rotational movements make the overall speed of the wedge bonding process less than thermosonic ball bonding. Alumin
Electronics Forum | Wed Aug 31 14:45:35 EDT 2011 | ryanr
Non-Hermetically sealed parts are parts are not air tight and gasses and liquids will pass into the package of the part and come in contact with the electrical or other components within the package (i.e. some switches, relays, transformers, etc.) D
Electronics Forum | Thu May 07 20:28:35 EDT 2009 | davef
From our notes, the following is a series of snips from: "Copper Dissolution in Tin" LJ Turbini, PhD, adjunct faculty member, University of Toronto, Materials Science and Engineering, SMT 2/07 As the solder becomes molten, copper from the board diff
Electronics Forum | Fri Aug 06 07:18:48 EDT 1999 | Graham Naisbitt
| | | | | Has anyone out there tried to parylene coat plastic parts prior to soldering them to a pcb? I'm looking at several potential applications where fewer than 5% of my components on a pcb are plastic, yet from a reliability aspect (environmenta
Electronics Forum | Thu Aug 05 13:03:35 EDT 1999 | Dave Weihrauch
| | | | Has anyone out there tried to parylene coat plastic parts prior to soldering them to a pcb? I'm looking at several potential applications where fewer than 5% of my components on a pcb are plastic, yet from a reliability aspect (environmental
Electronics Forum | Tue Sep 22 10:52:31 EDT 1998 | Wayne Bracy
| We have problems with voids when we solder lids to | ceramic flatpackages. | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | The solder is attached to the lid (preform) and the solder material
