Electronics Forum | Fri Jan 29 11:23:54 EST 2010 | ppwlee
Smtnet, I am looking at pros and cons for automated soldering. The application is a simple multi pin through-hole soldering on a high volume manual assembly line. The goal was to eliminate defects associated with missing solder pins which goes undet
Electronics Forum | Wed Jul 06 06:17:11 EDT 2016 | pavel_murtishev
Dear members, Recently we have found that solder mask thickness variation could lead to solder balling under QFN packages for a high reliability device. Is there any industry proven method for solder mask thickness checking? Any equipment or any me
Electronics Forum | Mon Sep 27 17:52:16 EDT 1999 | Scott Cook
| What selective soldering products should I use for a low production rate, high-mix product line? I am looking to get rid of some hand soldering. I have seen exselect (selective soldering pot method), pillarhouse (small flow solder nozzle with robot
Electronics Forum | Tue Apr 20 20:11:58 EDT 2004 | davef
First, how oxidized are these solder balls? Will the take solder using your routine flux / paste? Second, on restoring solderability, the three basic methods you can use to restore solderability on components are: * Highly active fluxes in a retinn
Electronics Forum | Sat Nov 04 11:11:19 EST 2000 | Claudine Corda
Mark - The Waverider is a great tool. It will let you know what's going on with the machine itself - contact time in the wave, parallelism of the wave, temp, and a relative idea of whats happening in the preheat section, and conveyor speed. We hav
Electronics Forum | Tue Jun 05 22:18:47 EDT 2001 | Dreamsniper
I don't understand why you wanna do this. The vendor has done this part for you and actually they have a recommended glue / solder paste life on the stencil or pcb (e.g. 6 hrs, 8 hrs.). If you will stick with their recommendations you won't be lost p
Electronics Forum | Tue Dec 14 15:21:41 EST 1999 | BJL
This may be the nickle paladium lead material or an 87/13 tin lead plating on the leads. Paladium and 87/13 has a slower disolution rate and takes longer for solid joint to be created between two metal surfaces. Reflow temp must allow the joint to be
Electronics Forum | Fri Jul 23 01:03:28 EDT 1999 | KYUNG SAM PARK
HI Earl Thank you for your answer. Let me know you about the hot you mentioned First of all, The rework machine is the BGA3500 manufactured by 0.k international ] ��DESOLDERING HEAT ��IRON TIP TEMP : 350-370��(MEASURED) ��REBALLING
Electronics Forum | Wed Jun 03 08:51:07 EDT 1998 | Pat Copeland
Can anyone tell me if there is a reference for smt component height specs on the bottom side of a board, which will also go through wave soldering. A current design I am reviewing has tant caps(7343) and a crystal on the back side. Should I only be
Electronics Forum | Mon May 06 16:14:41 EDT 2002 | russ
Would the lead finish on this part happen to be Paladium? I had a problem similar to this some time ago and we found the lead finish was not tin/lead over copper but paladium over nickel. We had to increase the reflow to 225 deg. C peak temp with t
