Electronics Forum | Tue Feb 19 15:59:55 EST 2002 | pjc
Surface tension is a likely cause. Surface tension is a negative wetting force. You may have a solderability problem. Be sure your flux is properly activated according to the flux mfg. top side board temp. specification. When surfaces to be soldered,
Electronics Forum | Tue Oct 19 19:25:40 EDT 1999 | Jeff Sanchez
Carol, I think the guys are right about you stand off problem but I want to address the wrinkleing of your masking. Although I think the temps you are subjecting the board to are very high and more than likely creating problems of their own. I th
Electronics Forum | Tue Jul 27 14:56:23 EDT 1999 | John Thorup
| | | | We are currently using a 65/35 solder for our wave process but are considering switching to a 63/37 for a substantial cost savings. No one here seems to know why we everused a 65/35 formulation in the first place. | | | | I understand 63/37 t
Electronics Forum | Wed Apr 16 16:55:38 EDT 2003 | russ
Thanks for the info, Here is a couple more questions (and you thought you were done) What size are these caps /res? how thick is your stencil? what type of oven are you using? what is the finish of the board? Anyway, it seems like (from a distance)t
Electronics Forum | Wed Oct 26 10:40:43 EDT 2005 | patrickbruneel
Jimmy, We've been soldering tin plated components and Ni/Sn (100% Tin) boards with leaded solder in the 80's in hirel and military applications. We never experienced reliability issues with the mechanical or electrical properties of the solder joint
Electronics Forum | Wed Sep 26 12:16:44 EDT 2012 | bwjm
Hi Guys,recently i am facing an issue. Refer to the attached photo. This PCB is high RF speed, gold immersion single layer. After reflow, my solder seems to have black stains on it. I tried with SAC305 paste water soluble and no-clean, both results a
Electronics Forum | Mon Dec 17 12:06:58 EST 2007 | pjc
5 Steps to Eliminate Bridges: 1. Establish (wave) Parallelism First and foremost, you must establish board-to-wave parallelism. This is the prerequisite to any wave solder process control. For an understanding of the power of this approach go to ht
Electronics Forum | Thu Apr 15 14:36:06 EDT 2004 | Ted
I need solder that has a solidus temp. of approximately 260C so that when sent through a second reflow of 260C the solder doesn�t become liquidus. However, I need the max reflow to be less that 300C because of the substrate.
Electronics Forum | Wed Apr 14 12:27:49 EDT 2004 | pjc
try Indium Corp's SMQ230. http://ncsmq230.indium.net/ Peak "on board" temps of 229C with good wetting have been obtained.
Electronics Forum | Fri Jun 12 01:17:58 EDT 2015 | armandogomez
hello! Can you be more precise on what you need ? like profiles in general? leaded? lead free? low temp profiles? cheers!
