Electronics Forum | Mon Apr 03 11:48:31 EDT 2006 | stepheniii
How big are the parts? I've only seen a few parts that ever fell off. Double sided reflow is probably the most common these days The surface tension is powerful. I think the lower limit of temperature is what you would have to worry about with epox
Electronics Forum | Fri Apr 21 18:02:16 EDT 2006 | SD
You didn't explain exactly how you are reworking the BGA and at what point the pad comes off. Assuming it's from an iron... The biggest cause of lifted pads is too much heat. Whether it be the iron temp or the amount of time the iron is on the pad
Electronics Forum | Sat May 20 22:09:43 EDT 2006 | Ola
Interesting... We had visitors from (maybe out of space) that claims that the fumes!!! from whithin the reflow leadead solder process in an oven can get caught inside the oven during time and later on when we fire up the beast to the lead free temp-p
Electronics Forum | Wed Jan 03 11:34:41 EST 2007 | SWAG
We have a SMT build that has been trouble from day 1. This board is about 2" x 2" and is panelized. The PCB is unusually thick (0.100"). The problem we always have (no matter if it's leaded or no-lead) is that the solder likes to wick up the heal
Electronics Forum | Thu Apr 05 09:18:14 EDT 2007 | pjc
Please note that pin holes and blow holes are not always defects. The latest IPC 610A Rev D workmanship standard has them as process indicators- depending on Class. I don't have the document handly while writing this. It would be good to look that up
Electronics Forum | Fri Dec 07 02:10:26 EST 2007 | mpolak
Hi, Could you guys verify my BTU VIP98N oven settings for lead free process. At the moment as my standard profile im using these settings 140 160 180 207 205 220 257 same temps for bottom and speed 50cm/min. Has anyone got same oven and could
Electronics Forum | Fri Jul 11 09:37:16 EDT 2008 | realchunks
BGAs are actually easy, but proper stencil design, solder paste placement and oven profiles are a must. Especially oven profiles as this is your only indication that the inner balls have reached proper temp, since you cannot visually tell. If you g
Electronics Forum | Thu Nov 27 10:55:51 EST 2008 | muarty
Hi Steve, Are you actually profiling the BGA itself? By that I mean have you, for example, drilled through the underside of the pcb into the balls of the BGA and attached a probe there? You may find that even although the topside components have a p
Electronics Forum | Wed Apr 08 15:16:14 EDT 2009 | waveroom
I would use almost the same profile you use when putting the component down on the board. Your pre-heat is essential in rework. Also even though your machine tells you your at a specific temperature I would add a thermocouple next to the component yo
Electronics Forum | Fri Jun 05 16:06:51 EDT 2009 | mjz289
This is from a section of an ALtera EP2SGX130-5 STRATIX 2 leadfree 1,508 ball BGA. What can be causing this? It is from an unused board (not assembled in a unit, or in the field, but it did pass electrical and function test. There are three of them i
