Electronics Forum | Wed Apr 20 10:16:21 EDT 2016 | ttheis
Yeah, I think it has to do with both changers being owned by the one head. If each changer was owned by separate heads then they would each need an open hole.
Electronics Forum | Fri Jun 24 07:32:53 EDT 2016 | davef
Tell us more ... Have you checked the density of your flux? How old is the flux? Is this a spray or a foam fluxer? What type of maintenance is being done? Do you get good hole fill with the the tank pressure of 130 on other boards?
Electronics Forum | Wed Aug 17 17:17:45 EDT 2016 | davef
Warpage of a completed assembly is an uncommon requirement. I would ask whoever is laying that requirement on you to define how they would like you to measure it.
Electronics Forum | Thu Oct 06 21:46:32 EDT 2016 | piyakorn
am worrying on a hight temp that will affect to others components mounted on board or not such ICs.. Thank you davef -
Electronics Forum | Tue Dec 20 04:35:09 EST 2016 | pcbepcb
I designed 0.5mm through hole, and 1.5mm the pad in my PCB, but the manufacturer told me they want to increase the cost because it is difficult to fabricate. But i think my design is correct. Any advice?
Electronics Forum | Mon Jan 09 23:24:47 EST 2017 | saju86ece
Hi, We are doing pin in paste reflow process in one our product ( but paste printed on bottom side of the board and top side will be assembled through hole component)in which faced cold solder issue in THT capacitor location after reflow. The solder
Electronics Forum | Tue Jan 24 05:33:25 EST 2017 | robertwillis
Did not see any emails from you and the limit is 10megs Why are you using 0.012" how thick is you board or what is t he hole to lead ratio as the thickness is high!!! Bob Willis bob@bobwillis.co.uk
Electronics Forum | Thu Mar 16 16:23:12 EDT 2017 | u4bga
I'm wondering what can we learn from an X-Ray analysis of solder joints - specifically, non-BGA joints (through-hole & SMT) joints.
Electronics Forum | Tue May 23 03:43:22 EDT 2017 | zsoden
Oh wow that is very useful insight! I will remove and check next time we fire up the machine! How did you know the factory size of the intake hole?
Electronics Forum | Mon Jul 10 02:33:48 EDT 2017 | dawson
"The Pin-in-Paste process can be used to solder through hole components using surface mount assembly process steps." I find it at https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5 Hope is helpful
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