Electronics Forum | Mon Jan 10 03:45:23 EST 2022 | proy
YES there is an IPC target/acceptable spec In general terms the barrel thickness in the hole should be 1 mil (thou). IPC has an allowable limit lower around .75 with some other factors. I have been checking barrel plating on all incoming boards since
Electronics Forum | Mon Mar 13 15:35:32 EST 2000 | Ioan
Stu, it is good you know that there are limitations and you want everything. Wish our designers work like that. So, the limitations we impose are dictated by the rails of the insertion and dispensing machines. Normally a .150" keepout will make a s
Electronics Forum | Thu Feb 24 14:58:11 EST 2000 | Greg denham
Does anyone have any information on baking boards to remove moisture before reflowing and waving assemblies? I've been told that we should do this to stop such problems as delamination of boards, blow holes, solder balls, etc. I don't know have any e
Electronics Forum | Thu Feb 24 06:09:26 EST 2000 | Robert Hutton-Squire
Hi, - any suggestions welcome... I have a 484 pin ALTERA fineline BGA - ball pitch 1mm (40) - ball size 0.48mm (18.9) What would you recommend for... 1. Surface pad size for the balls of this BGA device? 2. Stencil thickness/type and hole a
Electronics Forum | Wed Feb 09 12:02:15 EST 2000 | Wolfgang Busko
Sal: If it�s not the PCB, what about the connector itself ? Is it from a different production lot with some unregularities ( dimensions, tolerances, pin alignment, material weakness)? How about handling, storage, shipping causes ? Could it be a tooli
Electronics Forum | Thu Dec 14 19:38:28 EST 2000 | Dave F
OK, now let me ask the really dopey question ... so if the irregularity of the HASL surface is punching holes in the thermal gasket and causing shorts to the heat sink, why are you putting solder on that surface? I wonder how the thermal conductivit
Electronics Forum | Tue Nov 07 14:31:01 EST 2000 | John
My company manufactures a board for a heavy duty automotive application. One of the through hole parts on the board dissipates enough heat that it requires high temp solder. Does anyone know of or have experience with a high quality selective solde
Electronics Forum | Wed Oct 25 02:09:43 EDT 2000 | keith_hodgson
We are using a Universal GSM to place Densipaks.Unfortunateley every so often we hit a spell were the Densipak is raised because either one or both of the locating posts on the Densipak has not located correctly in the hole. These are very hard to re
Electronics Forum | Tue Sep 26 20:50:06 EDT 2000 | Dave F
Right!!!! We have built product with via holes only 0.010" off the edge of the routed edge or even routed them in half, which usually adds cost and shorts to the chassis. Most high speed routing has a tolerance of +- 0.005". It's common for UL fi
Electronics Forum | Wed Sep 20 12:43:40 EDT 2000 | rcroteau
RF pcb is all gold with no typical land patterns and multiple surface mount components sharing the same pad. IPC-610-B doesn't speak to inspection criteria. The problems I'm seeing are, insufficient solder, skewed components. Some of the pads have
