Electronics Forum | Mon Aug 09 10:27:14 EDT 1999 | Tim Murphy
Just curious what effect pinholes and solder voids can have on solder joints that have high current passing thru them. Also could moisture from steam sterilization (autoclaving) get inside a said solder joint and then outgas during high current, and/
Electronics Forum | Wed Jul 21 12:41:39 EDT 1999 | jason
I have pcb's in which i am experiencing warping. the boards are 12.8125" on a diagonal measurement. they are out approximatley .010". the boards are combination thru-hole,smt, they also have 3ounce copper.what is acceptable,and what is the propper fo
Electronics Forum | Wed Jul 07 09:47:41 EDT 1999 | Peter Brant
| | Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. WIth regards to this question, and scott's follow up, I have used the "epoxy me
Electronics Forum | Fri Jun 18 13:48:37 EDT 1999 | Earl Moon
| We currently use HASL on all of our boards and I would like to move to something else. I have sampled some boards with Entek OSP and I loved it, the problem is we have plated mounting holes on just about every board we make. Does anyone have info
Electronics Forum | Mon Jun 07 16:45:57 EDT 1999 | Dave F
| I was wondering what measurements are used to define pitch? | Frank: John's correct with the most common definition, but there can be others, depending on your perspective. TTYL Dave F Pitch. The center-to-center spacing between the (1) leads
Electronics Forum | Thu May 27 14:35:32 EDT 1999 | John Thorup
| One of our board fab houses is asking (again) to eliminate the reference designators and polarity markings from boards. This isn't feasible for thru-hole, but what is the industry trend on surface mount assemblies? | Who is working for who? I w
Electronics Forum | Wed May 26 09:56:46 EDT 1999 | Robert Wells
we have just started wave soldering passive SMT components and through hole. We are having trouble with voids on the SMT components. It is very random, but effects a lot of TSOT's. We are using an electrovert with a chip wave. Are there any obvio
Electronics Forum | Wed Jun 16 04:18:53 EDT 1999 | forrest xie
| | | we encounter BGA soldering issue. there is always some dry joint or unclear defects after reflow and the board can't pass electrical test, but if we resoldering it through hot air gun, every thing is ok. we use the "dog bone" surface pad ,that
Electronics Forum | Thu Feb 25 18:29:48 EST 1999 | Karl
| Fab Gurus, (Earl) | What are the disadvantages of using paper phrenwhatsit as a substrate. I want to justify changing a substrate from paper to chem3 or FR4 and I need some info regarding long term failure issues, etc. | | Thanks, | Justin | Ther
Electronics Forum | Thu Feb 04 20:31:10 EST 1999 | Dave F
| I'm researching SO-8 power RF device mounting methods. | | Possible mounting method | | 1. Via thru holes | | Still the thermal resistance of the PCB too high | | Do you have suggestions for mounting the component, PCB/? | Joni: What is it ab
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