Electronics Forum: hole (Page 176 of 318)

Soldering robot and solder balls

Electronics Forum | Tue Jun 20 15:08:30 EDT 2017 | ranap121212

Hello I have the problem with selective soldering on the robot. Thin balls appear on the laminate. The tin sometimes shoots...? and then the balls are a few millimeters from the soldering point. I tried up or down with temperature, but it did not wor

AOI for through-hole?

Electronics Forum | Thu Aug 31 02:10:05 EDT 2017 | hxamalia

Hello ALL Good day , it is Amalia from HX Circuit Technology Co.,Ltd in China, we are a prefessional PCB factory with many years. We are focusing on quick lead time for PCB with good service . please contact with me now ,thanks Email: amalia@hx-c

Anyone Place TH components with a Universal Platform machine? GSM, Advantis, Genesis?

Electronics Forum | Mon Sep 25 11:19:23 EDT 2017 | swag

We've done some of this - paste in hole. O.K. success but really we prefer to do stuff on selective wave for best results. For your application, look at a high force head to place the snap in component. Additionally, you might find it more efficie

Anyone who can help opening this .pcb file and converting it to gerber file?

Electronics Forum | Tue Oct 10 22:48:08 EDT 2017 | dawson

Hi Spoiltforchoice, you are right. I tried to download and setup the PCB Artist as you said. The pcb file is really designed by it, and I opened it, but unfortunately there is no any gerber output option. Maybe this sw is only used to design some sim

QFN84 Solder Printing Issue (QFN with Inner LGA Pad)

Electronics Forum | Fri Dec 01 09:29:36 EST 2017 | kojotssss

Hello. We have a problem with QFN type. Component is elevated. Stencils are reduced. Vias is without holes. What are the solutions to fix the fault. Look at the photo. Attachment: https://drive.google.com/open?id=1OIgaXUz2yoKP3fWZg2rUsrmZMBWidk6_

QFN84 Solder Printing Issue (QFN with Inner LGA Pad)

Electronics Forum | Fri Dec 01 13:55:44 EST 2017 | emeto

Brikainis, it looks like these vias are not plated and closed. I would say that thickness of your paste is lifting the part. Are you willing to try another stencil with ground pad apertures matching the via holes? It is probably worth trying. Anothe

Pin Hole Issue after Reflow Soldering - Passive Components

Electronics Forum | Tue Feb 13 14:39:52 EST 2018 | horchak

Your profile reflow temps are too low. Omnix338 has a melting temp of 217-221C. Your right on the edge, and your soak temps should be closer to 150 than 180C. Bottom line too high a soak, too low a reflow. Take it or leave it.1874

Pin Hole Issue after Reflow Soldering - Passive Components

Electronics Forum | Tue Feb 13 14:52:32 EST 2018 | emeto

I am totally with SweetOldBob on this one. Contamination or voids can also help to boost this defect, but considering that you are probably entirely burning off your flux in the soak zone, you might be getting oxidation on your pads and actually get

Pin Hole Issue after Reflow Soldering - Passive Components

Electronics Forum | Wed Feb 14 11:13:02 EST 2018 | horchak

Well it looks like you answered you own question. Why would you send the component out for cross section. Why wouldn't you try a different manufacture, assuming you have already used different date codes on this supplier. Is your company contract man

Pin Hole Issue after Reflow Soldering - Passive Components

Electronics Forum | Thu Feb 15 02:27:51 EST 2018 | ameenullakhan

Thanks for the wishes BOB. I am into process engineering. We don't contact the customer. SMT Line support. Customer might approve also. But our own quality team says its profile issues :(. Will see.what more can be done from our side. Thanks, Ame


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