Electronics Forum: hole (Page 31 of 318)

No Clean OSP process cause ICT testing issue due to Flux building in testvia hole

Electronics Forum | Fri Mar 29 07:53:12 EDT 2019 | davef

Why are you printing paste on test via? In the old days, we probed soldered pads to cushion impact force of probing. Is that still a reasonable practice?

No Clean OSP process cause ICT testing issue due to Flux building in testvia hole

Electronics Forum | Wed Apr 03 19:02:16 EDT 2019 | SMTA-Vikram

We still use Via as test points. so we need to paste Via. Pasting will make better contact with probes compare to test via without solder.

No Clean OSP process cause ICT testing issue due to Flux building in testvia hole

Electronics Forum | Thu Apr 11 00:58:44 EDT 2019 | SMTA-Vikram

Thanks for info regarding rotating probe head. We do not recommending to use this probes as it may damage bare board as it will pierce thru board and will shorted etches.. Avoid using this probe for PWBA

No Clean OSP process cause ICT testing issue due to Flux building in testvia hole

Electronics Forum | Fri Jun 07 05:19:23 EDT 2019 | gregoryyork

dont usually see this unless the Rosin hasnt been hardened due to low reflow or excessive pressure on blades squeezing flux out so you have flux rich areas. Are these boards also flow soldered?

No Clean OSP process cause ICT testing issue due to Flux building in testvia hole

Electronics Forum | Fri Mar 29 00:18:05 EDT 2019 | SMTA-Vikram

3% NDF. We using 8oz 90 degree blade type razor probes, still same issue. Is there stencil we can use or selective pasting test via so flux will not build in testvia. any help or guidance will be appreciate.

No Clean OSP process cause ICT testing issue due to Flux building in testvia hole

Electronics Forum | Thu Apr 11 00:54:49 EDT 2019 | SMTA-Vikram

Yes, we have try different Flux, probes. etc... also not to paste vs Paste Via, but still we have ~3% NDF due to contact issue. I am looking for selective pasting with less flux dispenser.Any idea or anyone has used? What about plug via before pas

Re: How many company are there appling the Pihr (Pin in hole reflow) in SMT PROCESS..

Electronics Forum | Thu Aug 31 00:07:24 EDT 2000 | Ramon I Garcia C

I Kyung: I'm not sure if we are working with PIHR but we insert some pines in a PCB with a pin inserter machine, after that we run this pcb in a screen printer and put over its solder paste, and then run in a chip shooter and then IC placer and f

No Clean OSP process cause ICT testing issue due to Flux building in testvia hole

Electronics Forum | Thu Apr 04 10:06:11 EDT 2019 | robl

Hi Vikram, Have you looked at the rotating flux buster style pins? A few people do them, but this is probably the best illustration: https://ingun.com/en/Products/ProductGroups/ICT_FCT/CategoryFolder/RotatingTestProbes We also find that the longer

White Hazing under the solder mask of a through hole board

Electronics Forum | Sat Nov 08 09:42:22 EST 2003 | ethercom

Hi: I have seen this problem before. It is caused by improper curing of solder mask by the fab manufacturer. When you run the board thru' wave solder, and then wash the board, you see the problem of white residue. However, when you apply heat, you c

No Clean OSP process cause ICT testing issue due to Flux building in testvia hole

Electronics Forum | Thu Apr 04 09:45:58 EDT 2019 | davef

That's what I guessed. Some ideas to consider are: Reduce usage of flux to the bare minimum. Choose a low solids flux Flux residues can be categorized as soft, brittle, sticky but this depends mostly on the formulation of the flux and the resins


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