Electronics Forum: hole (Page 76 of 318)

Topaz X error

Electronics Forum | Fri May 10 01:42:13 EDT 2019 | vinitverma

A Table is something that you can ignore right now. It is significant only in case of dual table machines such as Sapphire or Sapphire-X which have A and B tables (two independent PCBs being handled at the same time). In case of Topaz or Topaz X or E

Press fit connnector

Electronics Forum | Wed Feb 09 10:20:26 EST 2000 | Sal

Currently we have started seeing an issue around a scuzzy connector.The problem being that during insertion of this connnector a couple of pins refused to be inserted and as a result fold over, this folding of the pin is causing the pin itself to fra

Solder balls on solder side!!

Electronics Forum | Wed Feb 28 03:57:46 EST 2001 | peterbarton

Are you using a water based flux? Are the solder balls mainly around or near non-plated holes or near the edges of the PCB? If so the preheat must be set so the water content of the flux is fully evaporated before the board hits the solder wave. If

voids in solder

Electronics Forum | Fri Mar 02 08:52:20 EST 2001 | markkrmp

Are your voids looking like blow holes also? Is this only occurring on the solder joints of the Thru Hole components and Via's? Or does this happen on SMD pads? My experience is that we have seen this but only with some of our older PCB's which are

Wavesoldering

Electronics Forum | Tue Mar 13 20:25:39 EST 2001 | davef

So, what is not soldering? Pads er test points? I assume the holes are unsupported, right? Tell us more about the test points. Are they the kind with the little pastic shoulders [on the primary side] that keep them from falling through the hole?

Blow holes on radial parts solder joints

Electronics Forum | Fri Apr 06 11:37:19 EDT 2001 | raton

We had the same problem years ago when we started using a radial inserter. The inserter would dutyfully insert and clinch the leads. The problem in our case was the component body sealing to the fab, especially on electrolytics caps with a film jac

Pad Design

Electronics Forum | Mon Apr 16 10:55:01 EDT 2001 | genny

Happened at my company lots on our older designs. We touched up those pads in house by hand, because the solder joint was very poor. We also did it on SOT 86 pkgs on the gnd pins. When they were touched up, we would get an extra 1/2dB of gain out

Re: Stencil Printing

Electronics Forum | Thu Jul 20 14:52:05 EDT 2000 | Bob Willis

If you are talking about Pin In Hole Reflow that is not true, I hope it was not my friends at Speedline that told you that. Stencil printing of paste for through hole reflow can be done. If you get all the parameters right it can give you joints lik

OSP vs HASL

Electronics Forum | Mon May 14 14:51:36 EDT 2001 | Brian W.

Personally, I prefer the OSP. I get a flat surface to deposit paste on, resulting in more consistent solder paste volumes. With HASL, the amount of plating and the mounding affect the paste deposition. I have even had it affect the placement. The

Re: SMT beginner

Electronics Forum | Wed Sep 15 12:45:34 EDT 1999 | Wolfgang Busko

| | Hi, Can someone tell me how can I identify a finished product which make by SMT technology or not ? We assembly memory modules now and want to diversify our products range now. | | | | Thanks !!!!! | | | | | | | Ah, a fair maiden not yet sa


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