Electronics Forum | Tue Sep 28 08:07:48 EDT 1999 | Doug
Does anyone know of a web site (or other source) that illustrates the orientation of polarized SMT packages with respect to the carrier tape sprocket holes? THANKS, Doug
Electronics Forum | Wed Sep 08 21:36:14 EDT 1999 | kyung sam park
| I have a board that has surface mount on both sides . On this board is a 22pin connector which is the only thru-hole part.This part is located on the component side. I would like to reflow this part. Can this be done? If so, how can this be done?
Electronics Forum | Wed Sep 08 22:49:38 EDT 1999 | Jason Tomlinson
| | I have a board that has surface mount on both sides . On this board is a 22pin connector which is the only thru-hole part.This part is located on the component side. I would like to reflow this part. Can this be done? If so, how can this be done?
Electronics Forum | Wed Sep 08 17:42:06 EDT 1999 | John S.
We are currently quoting several vendors on the through hole portion of a new mixed technology production line. Unfortunately, I have not been able to find much information about NEA's cabaility, quality, or service. Any comments or references wou
Electronics Forum | Tue Aug 24 10:36:20 EDT 1999 | Chad Barnett
JUST WANDERING IF ANYONE IS PRINTING ADHESIVE ON THE BOTTOM SIDE OF BOARD WITH THROUGH HOLE COMPONENTS ALREADY PLACED. I'VE BEEN TOLD IT IS POSSIBLE BUT WANT TO LOOK INTO THIS PROCESS IN DEPTH.
Electronics Forum | Thu Aug 12 19:30:22 EDT 1999 | Kris Harris
| We are using a mixed technology process with mostly through-hole parts plus some SMT IC's on the component side and some passive SMT parts on the solder side. We do not have a proper wave soldering machine for doing solder side SMT (double wave or
Electronics Forum | Wed Jul 07 00:28:59 EDT 1999 | Scott Cook
| Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. John, It depends......mainly on the via size. Tenting works on smaller vias. Tent
Electronics Forum | Wed Jul 07 10:25:13 EDT 1999 | John Thorup
| | Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. | | John, | It depends......mainly on the via size. Tenting works on smaller vi
Electronics Forum | Mon Jul 05 17:50:26 EDT 1999 | John
Is the no clean solder paste as good? We are wondering if we can elliminate the wash when we change from through hole to surface mount.
Electronics Forum | Fri Jun 04 13:22:20 EDT 1999 | John Martell
We are changing from through-hole to SMT, wondering what pitch requirements would an 8 pin SOAC require for pick and place? We think that this would be our finest pitch part.