Electronics Forum: hole and in and fillet (Page 1 of 2)

pin in paste and hole diameter

Electronics Forum | Sun Mar 28 18:49:36 EDT 2021 | mekmat544

Hello, I would like to ask you if there is some formula how to calculate PTH hole and annual ring for pin in paste technology? Thank you. Mekmat.

Re: Bottom side smt and thru hole

Electronics Forum | Wed May 27 14:35:52 EDT 1998 | Justin Medernach

R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recomm

Re: Bottom side smt and thru hole

Electronics Forum | Wed May 27 13:42:08 EDT 1998 | Chrys

R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recommen

Pin in paste connectors and lead-free questions

Electronics Forum | Thu Aug 22 23:09:34 EDT 2019 | sssamw

Yes, you need work with supplier to see if can run pin in paste for these connectors, even do some experiments. A step-up stencil would be good for these connectors, also connectors pin size and length match with PCB hole design.

Pin in paste connectors and lead-free questions

Electronics Forum | Mon Jul 22 09:53:13 EDT 2019 | kylehunter

Hey all! As background, I recently purchased a full SMT line for my company. We have a DEK 265, an assembleon opal xii, and a Heller 1500. Currently our jobs are leaded, and the heller is working perfectly. An upcoming job that we are potentially g

"Gap" in completed solder joint between lead and pad

Electronics Forum | Wed Nov 29 11:46:57 EST 2006 | slthomas

IPC 610 *C* states that the solder thickness requirement is a properly wetted termination is evident. Fillet height is another aspect and is usually specific to the package but is some function of solder thickness plus a percentage of lead height. D

Step by step guide in evaluation of Solder Bar and Flux

Electronics Forum | Mon Dec 11 20:44:37 EST 2006 | davef

Title : LEAD-FREE WAVE SOLDER FLUX EVALUATION Author : Michael Havener Author Company : Benchmark Electronics, Inc Date : 09/25/2005 Conference : SMTA International Abstract : The European Union�s deadline to ban lead in electronic pr

"Gap" in completed solder joint between lead and pad

Electronics Forum | Thu Nov 30 16:10:05 EST 2006 | Hussman

Wow, why all the anger? This gap you guys are talking about is measured as "G" in IPC/EIA J-STD-001 (Chunks was there, but she failed to read the fine print). And almost all parts that measure G follow Note 3 which states "Properly wetted fillet s

ICT Question, Via holes and Probes

Electronics Forum | Fri Apr 27 08:44:08 EDT 2007 | Brett

For those of you who use via holes as test points, and the via holes must be filled at the wave, is it necessary to have a "dome" on every single test point, or is it sufficient to have the via "filled" with solder? The ICT preson here insists that

ICT Question, Via holes and Probes

Electronics Forum | Fri Apr 27 10:55:54 EDT 2007 | Brett

Pete, is there a probe-style that will accomodate a via that's filled, but a little concave (inward) fillet? The ICT personnel complains about this scenario too. I'm not an ICT person, but I do know that there are pogo pins that have a crown (for t

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