Electronics Forum: hope (Page 241 of 341)

Re: Min Hole/Pad distance to edge of PCB

Electronics Forum | Thu Mar 23 14:17:47 EST 2000 | Finepitch Services

Stuart, My suggestion is a DFM meeting (most of the process people dream about a meeting like this, and luckily, I've been to a few) with: - project manager (if there's one) - customer service rep (annual volume, lot size, product life) - smt proce

Re: Farewell to fellow old-timers and up-and-comers alike

Electronics Forum | Thu Feb 17 10:38:46 EST 2000 | Keith Luke

Scott, We always regret to see a dedicated user leave the fold. Over the past few months we have made many changes to the site, and we believe, improved the quality of the forum experience for our users. During our recent site upgrade we respond

Solder Pot Temperature

Electronics Forum | Mon Feb 05 06:57:52 EST 2001 | PeteC

Dason, IPC/EIA J-STD-001C states: "....temperature within the range of 230C (446F) to 290C (554C)." That's a pretty wide process range. 250C has been typical in the past. We run ours from 230C to 240C. We have found that some single-sided PCBs can de

Wave Solder Immersion Depth, Contact length, Dwell Time etc.

Electronics Forum | Fri Feb 16 02:00:12 EST 2001 | PeteC

Dreamsniper, The optimum contact (dwell) time in the wave should be 2 seconds. Contact band width is a function of conveyor speed. For an example, 5cm of contact band width at 150cm/min. conveyor speed will give you 2 seconds of contact time and 2cm

Solder Shelf Life

Electronics Forum | Tue Mar 20 20:12:32 EST 2001 | davef

In response to a similar question Dennis Fritz [DDFRITZ@AOL.COM] Chair of the Alternate Final Finishes Committee of IPC (5-23d) said ... The Alternate Final Finishes Committee of IPC (5-23d) has nearly completed a round robin "conditioning" study of

No-clean solder paste

Electronics Forum | Thu Mar 22 17:38:44 EST 2001 | davef

OK, lemme take a different angle on this, �cuz I forgot to touch on this when I first responded. I mentioned a study ["Evaluation of Low Residue Soldering for Military and Commercial Applications: A Report from the Low-Residue Soldering Task Force"

Adhesive Application by Stencil

Electronics Forum | Fri Mar 23 14:13:20 EST 2001 | mnaddra

RW, I have Screened Adhesive on to several different assemblies and have found that when it is possible I get a much better result than with a dot deposition process (The green strength was greatly improved), the biggest issue I ran in to was the pr

AOI systems

Electronics Forum | Wed Mar 28 11:53:50 EST 2001 | Steve

Take the leap of faith my friend!! Buy the AOI and watch all of your problems disappear. Okay, so I exaggerated a bit. Let me tell you the real story. We purchased a CR Technology RTI6500 almost two years ago. We chose the CR Tech unit because it wa

PCB Trouble shooting Lab

Electronics Forum | Tue Apr 17 09:38:04 EDT 2001 | CAL

With some help from our good Friends at Agilent Technologies our RF Lab includes testing up to 100GHz. Equipment includes Vector network analyzer, signal analyzer, dual channel power meter, noise filter meter, advanced impedance analyzer (including

Mydata vs Siplace

Electronics Forum | Mon Apr 29 09:58:38 EDT 2002 | pjc

Machine Data Mydata MY9 machine weight: 1800kg placement repeatablilty @ 3 sig: 15 micron x-y axis drive mech: x combo belt rackπnion, y ball screw Siemens F5 machine weight: 1500kg placement accuracy @ 3 sig: 30 micron x-y axis drive mech: x belt


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