Electronics Forum | Tue Sep 11 12:45:01 EDT 2007 | rgduval
Both questions will depend upon the IC specifications. Check the manufacturers recommendations for temperature specification, as well as reflow profiling. As a general rule, we don't like to rework a component more than 2 times after initial reflow
Electronics Forum | Wed Jul 02 12:49:57 EDT 2008 | jlbelectronics
Hi all, I have a OK industries hot air pencil model number SMT-1160 even though the label on the base says its a SMT-1102. The problem that I have is that the Diaphragm (diafram) has ruptured inside the small internal air pump. Where can I get a p
Electronics Forum | Mon Nov 17 09:47:25 EST 2008 | cisridn
I would not recommend doing BGA soldering with only a hot air gun. I have done it in the past, but the boards would eventually come back from the field because the solder joints did not form correctly and the BGA would have to be reworked again. I
Electronics Forum | Fri Aug 14 18:48:36 EDT 2009 | secura1
It's some time difficult to control process when > using a heat gun. What is the intent of using the > heat gun after test? we agree... the heat gun method was an experiment. We are planning to us a hot air re-work station. The intent is to re-
Electronics Forum | Tue Jan 11 19:38:44 EST 2011 | hegemon
There are a number of manufacturers of Benchtop Hot air stations. For what you are describing, look at Hakko as well as A.P.E. (if they are still around, they made a great little machine called a ?Chipmaster?, and if you added preheat, I think you
Electronics Forum | Wed Apr 03 04:08:20 EDT 2013 | ericrr
Yes well, now we used to add a bit of flux to our leaded paste to make it slightly runny, But when we went to unleaded paste the joker who came in from another company to set the temperature on the oven said "you dont add anything to unleaded paste!.
Electronics Forum | Thu Nov 30 23:31:49 EST 2000 | CAL
Dave F- FYI SMFL3000 is a manual placement/ reflow machine from Dima SMT (WWW.DIMASMT.com)origin, the Netherlands. In the USA Manncorp Reps Dima. I would reflow each IC component by itself and do an isolated mass reflow on the chips, then run to a s
Electronics Forum | Mon Aug 14 13:10:43 EDT 2000 | Casimir Budzinski
HI My board house has asked us to change to E TIN 34 Solderable Immersion Tin we curently use Hot Air Leveling, we do SMT & thru hole and use no-clean flux. If anyone out there knows any thing about E TIN 34 Solderable Immersion Tin good or bad I wou
Electronics Forum | Thu Jul 06 02:08:27 EDT 2000 | Ralph Landry
I need to build a couple of prototype SMT boards and need some recomendations on some adhesive or epoxy to use to hold the parts down prior to hot air soldering. I find that some parts want to skip across the board when heated, or they want to walk
Electronics Forum | Thu Jun 29 07:48:59 EDT 2000 | Mark
Welcome Bob, HASL stands for "Hot Air Solder Level" and is the final finish the raw boards guys place on the solder pads on the PCB. There are two popular raw board finishes, HASL which is a solder finish and NiAu which is Nickle Gold, and is a Gol
.gif)
