Electronics Forum | Mon May 03 10:08:41 EDT 1999 | Cunli Jia @ SMTnet
| Why don't you publish this in SMTnet papers? I'm sure many would be interested in reading it. You have written many of the papers have written have broad interest. Thanks. Dave F Dave: Thank you for the suggestion. Bob: We would very much lik
Electronics Forum | Mon Nov 16 14:01:31 EST 1998 | Earl Moon
| Has anyone heard of a process called White Tin for depositing a solderable surface on a pcb rather than the standard hot air solder leveling? | White tin is another take on the tin immersion process proported to eliminate problems associated with
Electronics Forum | Sun Oct 18 01:55:16 EDT 1998 | PARK KYUNG SAM
WE USE 3 chamber OF Mc-DRY(MODEL NAME). THE MACHINE CAN REMOVE HUMIDITY FROM PARTS IN THE GENERAL PERIPHERAL TEMPERATURE (MAY BE 25-30;CENTIGRADE). AND IT'S CONVENIENT FOR MAN TO PUT OR TAKE OUT COMPANENT FROM CHAMBER BECAUSE THERE IS NO HOT AIR AN
Electronics Forum | Fri Sep 18 10:53:37 EDT 1998 | Jim Wilde
I am looking for a small benchtop rework station for replacing bad QFP132's as well as a variety of SO8 to SO20 components and 1206 chips. I've been looking into some IR heating equipment as well as hot air tools, but have little experience with suc
Electronics Forum | Fri Aug 21 07:38:34 EDT 1998 | Tryin'
| | Will somebody please explain HASL (here). Thanks. | Tryin: HASL: Hot Air Solder Leveled. A board fabrication process that applies an oxidation preventing solder coating to copper pads on the board. Dave F You do this to keep the green stuff (
Electronics Forum | Tue Mar 10 17:56:43 EST 1998 | Jeremy Smith
I am having a problem with Entek coated boards. The solder past seem to just ball up on the pads. I had no problems with the board when it was hot air leveled. The board is double sided surface mount. I have tried adjusting the oven profiles makin
Electronics Forum | Sat Jan 03 18:13:58 EST 1998 | David Jacks
Tom: You are right. Pre-heating is just as necessary in rework as it is in intiial production. Zephyrtronics produces an economical convective bottom side pre-heater known as an airbath. This product ramps the substrate and assembly at 2-4 degrees
Electronics Forum | Thu Jan 01 13:04:42 EST 1998 | scott cook
| Has anyone had any experience with thermal shocking | and cracking of SMD capacitors during the rework process? | My company was advised to preheat capacitors to 125 C | at a rate of 2 C/sec before replacing them onto boards. | Would this maybe
Electronics Forum | Mon Sep 24 11:12:56 EDT 2001 | nwyatt
Hi. We are currently using an unconventional method to rework a micro BGA - removing component with hot air, fluxing the area, placing the part with pick and place, then reflowing it in the oven. The reason we are doing it this way and not with a r
Electronics Forum | Wed Mar 20 11:14:15 EST 2002 | cfraser
Guy's I am sorry but your dike removal process for chip components is midievil at best. The fastest way to remove a chip is with 2 solder irons. Place one iron on each end of the component. This process is completely safe and takes about 2 seconds pe
