Electronics Forum | Tue Jun 08 17:51:37 EDT 2010 | vmorina
Hi Vee, We are planing on doing low-medium volume and prototyping boards with the following packages. TQFP, BGA and other SMT packages. I would like to go with some thing like batch/tabletop oven for now, but I am not excluding conveyor reflow oven
Electronics Forum | Sat Jun 19 03:11:25 EDT 2010 | sarason
I have used the Quick ? from I don't remember what company. But it was a smallish machine ie about the size of a washing machine. The heat/cool cycle was about 30 to 45 minutes. every thing had to be properly sealed or you would loose vapour, this va
Electronics Forum | Mon Aug 30 11:09:13 EDT 2010 | davef
Lots of small parts, lots of hand soldering, lots of tired eyes inspecting on lots of boards: yields lots of room for error. How about this: * Part removal ** Cut each resistor between the pads using dykes ** Using a soldering iron [or hot air pen],
Electronics Forum | Fri Nov 19 13:07:01 EST 2010 | vmorina
Hello everyone, Talking to my boss today I was able to determine what we're really looking for in terms of reflow soldering. The company is not looking to do a volume run; we're trying to solder chips for prototype boards, which are currently done w
Electronics Forum | Mon Jan 17 21:14:19 EST 2011 | hegemon
Of the machines you have mentioned, the APE Bandit is your best bet. I had one of those in a previous employ and it was basically bulletproof, and simple enough to work on if things went wrong. Simple controllers and enough power to do the job at r
Electronics Forum | Wed Apr 06 04:18:03 EDT 2011 | emmanueldavid
TK, Hope you got it right only for this round of assemblies. Well, passing through a Reflow belt is not an ultimate process to dry circuit cards & take out moisture from Solder finished layers. First of all, if the packs were not unsealed (even s
Electronics Forum | Thu Sep 15 19:12:27 EDT 2011 | smtmaxmary
WELCOME TO SMTmax Established in 2009, the Omxie Corp. is headquartered in California, with several offices worldwide. Our primary focus is in the development, manufacturing and marketing of SMT tools and equipment for prototyping and production. Ou
Electronics Forum | Thu Mar 29 07:37:45 EDT 2012 | davef
The current discussion about solder fountains has to do with copper dissolution. Broadly, copper dissolution is the weakening of copper traces where a trace and a barrel plating intersect due a loss of the copper into the solder. Longer contact time
Electronics Forum | Thu May 31 21:45:48 EDT 2012 | davef
rsthompson ... if you're talking about bare boards IPC-5701, Users Guide for Cleanliness of Unpopulated PBC, Table 8 ||Bare board final surface finish Ions||Hot air solder level||OSP over copper||Gold over nickel Chloride||0.75 ug/cm^2||0.75 ug/cm^2
Electronics Forum | Tue Jul 03 16:15:08 EDT 2012 | kq702
Hi, when they did the reflow with the south bridge chipset they took a heat gun and went arround the chip in circles. This is what I did with the broken apple motherboard. I covered the board in tinfoil and cut out the squares arround the gpu, cpu an
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