Electronics Forum: hot and air and dewetting (Page 1 of 2)

0402 tombstoning and dewetting on QFP256 trade-off

Electronics Forum | Thu Mar 05 11:53:09 EST 2009 | dcell_1t

Hello to all. for certain time, we have been struggling with some issues on a PCB where have tombstoning on 0402 components (due to pad design) and dewetting in qfp256 0.5 mil pitch (discussed on another threads on this forum) component, we have pro

BGA rework and inspection

Electronics Forum | Thu May 30 10:31:03 EDT 2002 | robbied

Hi Yannick. This is an issue that we are just recently getting into but here is some ifo that I have gathered so far. I have seen/ used 2 different rework machines. The one we have bought is a 'PACE TF2000' which was at the lower cost end of the mar

Heat guns and component damage

Electronics Forum | Tue Jan 31 15:15:13 EST 2006 | russ

Heat guns used improperly will definitely damage components. You must have a controlled heat gun that can be set to the max temp you want pb =215C max, Pbfree maybe 240C max. This heat gun must not be able to be adjusted or you must have total trus

Water wash flux and cleaning

Electronics Forum | Mon Jun 19 09:47:23 EDT 2017 | georgetruitt

You have a lot to think about! What does the flux manufacturer recommend as far as specifics like water temp or pressure? Do they recommend high temp di-water a detergent or saponifier? Do you currently have a cleaning machine, batch cleaner or inl

BGA: reworking BGAs, testing and inspection

Electronics Forum | Thu Feb 11 15:07:49 EST 2010 | hegemon

With regards to the rework, size and mass of the PCBs is important, in addition to the size of the components that are to be reworked. You might be in the game with $6K (APE Chipmaster Hot Air machine with Preheater or similar setup) if you have sma

Required humidity for SMT production and storage

Electronics Forum | Thu Apr 12 13:04:47 EDT 2007 | slthomas

Handling requirements of all classifications of moisture sensitive devices is found in J-STD-033. It really isn't an issue for most parts unless they're going to reach reflow temperature again, which is unlikely unless you're removing a nearby compo

Re: Desoldering of TSOP and TSOJ

Electronics Forum | Fri Jan 08 19:47:55 EST 1999 | Kwang-Seong Choi

| | HI! I am a package engineer in Korea. I have some reasons | | to desolder excessive solder at the lead of TSOP and TSOJ | | after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. | | Does

Re: Desoldering of TSOP and TSOJ

Electronics Forum | Sun Jan 10 08:44:32 EST 1999 | Dave F

| | | HI! I am a package engineer in Korea. I have some reasons | | | to desolder excessive solder at the lead of TSOP and TSOJ | | | after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. |

Foam fluxer maintenance, storage and cleaning

Electronics Forum | Sun Nov 08 15:27:25 EST 2015 | davef

Thinner: Flux thinner, NOT paint thinner We kept a spare stone in thinner in inventory. We cut PVC pipe to size, cap in one end, screw thread on the other, stone inside, filled with flux thinner and covered with a screw cap. I don't remember who we

Re: Ionic testing and No-Clean flux

Electronics Forum | Sat Feb 05 09:08:18 EST 2000 | Dave F

Casimir: Let me expand on something that I said in my response to your thread on ionic testing. Generally, no-clean people don�t use ROSE testing as part of their process control, because the ROSE test is essentially washing your board in DI/IPA �

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