Electronics Forum | Wed Jan 07 12:09:40 EST 2004 | Kris
Hi All, Does any body have any information on hot bar lead free soldering ? Need papers or experimental data ASAP Thanks
Electronics Forum | Wed Sep 10 12:56:09 EDT 2003 | davef
Intermetallic compounds [IMC]: * Form during the alloying process of some metals. In soldering these are Sn, Ni, Ag, Cu, Au. * Do not accept solder. * Increase in depth in logarithmic proportion to both time and temperature. [So during the solder
Electronics Forum | Thu Sep 20 07:18:42 EDT 2018 | proceng1
Has anyone else been experiencing this lately? We have had a rash of boards that come in properly vacuum sealed. We store them in the hot room until we are ready to build, and we get bubbles under the solder mask. We've had 4 different jobs, all di
Electronics Forum | Tue Nov 28 21:16:17 EST 2006 | davef
J Rose at EMPF says: The introduction of no-clean solder fluxes in electronics manufacturing has given rise to greater levels of solder balling simply because the opportunity to remove them in the wash process does not exist. They are typically cause
Electronics Forum | Thu May 30 10:31:03 EDT 2002 | robbied
Hi Yannick. This is an issue that we are just recently getting into but here is some ifo that I have gathered so far. I have seen/ used 2 different rework machines. The one we have bought is a 'PACE TF2000' which was at the lower cost end of the mar
Electronics Forum | Mon Dec 22 14:15:41 EST 2008 | ck_the_flip
As Emil says, it's 100% the glue! Your paste is not designed to hold parts on at wave solder. Reflow is MUCH hotter than glue, so I doubt you're not adequately heat-curing it. Possibly, the glue cure is "too hot" and maybe making the material brit
Electronics Forum | Sat Jul 26 07:42:49 EDT 2008 | pcbbuilders
I am not very concerned about production time, but it is always a thought! Quality is more importnant of course. We have 2 different pastes, with almost identical requirements. We can get close to their profiles, but i am worried that i am spending
Electronics Forum | Tue Jan 31 15:15:13 EST 2006 | russ
Heat guns used improperly will definitely damage components. You must have a controlled heat gun that can be set to the max temp you want pb =215C max, Pbfree maybe 240C max. This heat gun must not be able to be adjusted or you must have total trus
Electronics Forum | Wed May 21 08:16:57 EDT 2008 | tonyamenson
Good morning gentlemen, I could use some advise as to the min / max windows for the wave process. We have had little problems with our leaded wave but when applying the same process to lead-free wave we are having problems. Obvisouly the temps are
Electronics Forum | Wed May 21 13:59:19 EDT 2008 | pjc
Here's what I've seen for no-clean flux applications: Leaded: Dwell Time is? 2 - 3 seconds Top side board temp max? If some small SMT parts reflow are we too hot? 110 to 120C top side board temp just before hitting the wave(s) Pot temp. 245C Lea
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