Electronics Forum: how and dpmo and being and used (Page 1 of 4)

Advice on used pick and place machine

Electronics Forum | Mon Oct 09 07:50:22 EDT 2006 | quad

We currently run two Quad IVC's (we are very pleased with them) and two Versatronics for simple small volume batch work. We now need an additional machine capable of placing components at least three times as quickly as a IVC. We don't do anything ve

Pick and Place Rivet

Electronics Forum | Tue Aug 12 14:49:26 EDT 2008 | awegener

I'm attempting to pick and place a small rivet onto our PCB. The rivet should be attached via reflow solder. The rivet will be used to create a sandwich, holding together a frame and additional circuit board in a package. This part is intended onl

DPMO calc and Overall Manufacturing Index (OMI) calculations

Electronics Forum | Mon Aug 27 19:24:00 EDT 2001 | sharafali

It has been mentioned that DPMO offers large advantages over First Pass yield calculations for measuring process performance!!regarding the same I have a few queries: What are the benchmarks for using DPMO as measures of process performance? How is

Re: Geometric Dimensioning and Tolerancing

Electronics Forum | Sun Jun 07 02:06:26 EDT 1998 | Earl Moon

| Earl, | As always, I am interested in what you have to say, but I am still a little vague on your application of ANSI Y14.5 as it relates to the manufacturability of an assembled printed circuit board. Are you implying that component placement coor

board stretch and IPC -D-300G

Electronics Forum | Mon Nov 12 16:14:47 EST 2001 | davef

Yes!!! How can we assemble boards with 20 pitch when we allow 0.008� error to the master art? Excellent question!!! IPC-D-300G has nothing to do with assembler requirements. It is written by and for fabricators, so that they can be comfortable.

tape splicing pros and cons

Electronics Forum | Wed Sep 21 12:30:03 EDT 2005 | Rob

Hi Greg, We've used lots of machines over the years & seen lots of different tape related issues - the main one being snap off of the cover tape, usually due to too much glue, over entusiastic heat seal, or a feeder requiring maintainance. Also the

Re: BGA and Gold Boards

Electronics Forum | Fri Jun 19 10:03:46 EDT 1998 | Earl Moon

| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike Mike, We and ind

V-Tek Tape and Reel Machines...

Electronics Forum | Thu Apr 22 13:43:14 EDT 1999 | Steve Gregory

Hey Ya'll! Have any of you ever worked with one of V-Tek's "Economax" tape and reel machines? The biggest thing I'm curious about is the type of cover tape that these machines use. It's something they call P.S.A. (Pressure Sensitive Adhesive)cover t

Cracking Capacitors and Solder Balls

Electronics Forum | Mon Jun 08 14:19:30 EDT 1998 | Gary Simbulan

Earl, et al, Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. First the caps. We still have

floor and air conditioning, shop floor requirements

Electronics Forum | Tue Apr 30 05:05:16 EDT 2013 | pavel_murtishev

Colleagues, Now I am involved into plant ramp-up where 3x Panaconic NPM-W will be installed. New production hall is being designed right now and the problem is that constructors have never met SMT shops and know very few or next to nothing about requ

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