Electronics Forum | Thu May 26 08:52:42 EDT 2011 | davef
Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste � Not An Option Contributed by Phil Zarrow of ITM an Independent SMT consulting firm With soldering being the dominant source of assembly
Electronics Forum | Sun Jan 07 08:46:08 EST 2018 | spoiltforchoice
Your paste should specify a number of times it is OK for various things to happen. The two you might care about are the "Stencil Time"/"Working life", which is how long the paste can be out of the pot on your stencil while you print PCBs. The othe
Electronics Forum | Thu Aug 24 15:37:50 EDT 2006 | Chunks
Hi Any, This is from an earlies thread "Solder Ball After Reflow Process". Date: August 16, 2006 01:52 PM Author: Russ Subject: Solder Ball After Reflow Process Oven settings are meaningless here. What does the board see? It is the paste we a
Electronics Forum | Thu Jun 13 20:55:46 EDT 2002 | russ
Having just gine through a similar problem myself (with much less equip.) Here are a few things to consider and/or look at Do you have the proper pad size? It should be the same size as the pad on the BGA. Is the board warping during your operati
Electronics Forum | Thu May 21 09:54:07 EDT 1998 | Justin Medernach
| I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and solde
Electronics Forum | Fri Feb 19 09:14:52 EST 1999 | Justin Medernach
| During inspection and test we find leads which do not get soldered. Some are because of insufficient paste, but with others everything looks right. This will only happen on 1 to 2 pins, and it is not isolated to a specific type of ic or location o
Electronics Forum | Sun May 30 08:50:42 EDT 1999 | Dave F
| Yes l know this problem keeps cropping up on the forum but l've missed some of the follow-ups. | | Our problem is that the lifting only occurs on 3% of production so actually detecting an improvement is difficult. We're actually having to inspect
Electronics Forum | Tue May 26 14:50:07 EDT 1998 | Dave F
| | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and sol
Electronics Forum | Tue May 26 20:18:09 EDT 1998 | Justin Medernach
| | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and
Electronics Forum | Tue May 26 15:27:36 EDT 1998 | Dave F
| | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and s
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
.gif)
winsouce.jpg)
