Electronics Forum | Thu Mar 04 07:57:32 EST 1999 | John Godfrey
I need to setup an oven to run with a nitrogen atmosphere for boards with BGA's, but our ovens do not have the optional atmosphere monitor and controller. Is there a good way to sample and control the atmosphere without the optional built-in atmospe
Electronics Forum | Thu Mar 04 08:50:53 EST 1999 | Dave F
| | I need to setup an oven to run with a nitrogen atmosphere for | boards with BGA's, but our ovens do not have the optional atmosphere monitor and controller. Is there a good way to sample and control the atmosphere without the optional built-in
Electronics Forum | Tue Mar 09 07:06:42 EST 1999 | Charles Stringer
| | | | I need to setup an oven to run with a nitrogen atmosphere for | | boards with BGA's, but our ovens do not have the optional atmosphere monitor and controller. Is there a good way to sample and control the atmosphere without the optional bui
Electronics Forum | Mon Feb 19 22:56:20 EST 2007 | davef
Russ We agree with your comments on plugging from one side only. But... We believe that it IS possible to trap process chemicals [technically, not flux] in a blind [or any other] via. This can be done by plating the via closed, rather than pluggi
Electronics Forum | Tue Sep 16 11:42:35 EDT 2008 | slthomas
If support is a concern, don't forget that any support provided by equipment manufacturers will most likely (certainly with Juki and Universal) require registration of the machines at a cost to you of probably $2k-$5k per machine. Some used equipment
Electronics Forum | Tue May 21 17:16:51 EDT 2002 | davef
Larry, Yes, no matter how much you�d like to avoid using NC, you probably will have to start using the stuff, if the design [sales, in your case] types have their way. We can clean WS under 1mm and 1.25mm pitch BGA. For 0.8mm pitch BGA, we use NC.
Electronics Forum | Mon May 07 16:07:05 EDT 2012 | davef
Start with targets based on the stencil thickness (for height) and stencil thickness times the aperture size (for volume). * Set reasonable upper and lower control limits (+ 25% and –25 % of the targets, for example). * Next, check the printer set-u
Electronics Forum | Thu Jun 19 21:39:31 EDT 2008 | mika
Hi, we used to have a RoHS package with uBGA 380 Solder ball's 0.8 mm pitch approx 15x15 mm, bump size is 0.4mm on a 0.33mm pad. Suddenly we need to use another vendor for various reasons. However, the new bump size is 0.45mm according to specs and t
Electronics Forum | Fri May 20 03:14:03 EDT 2016 | designhaus
Hello, We are about receive an 85.000 USD award grant towards purchasing manufacturing or testing equipment for our company. We are trying to figure out how to best use this grant. Here are short facts about us: We are a design house, so all our ma
Electronics Forum | Thu May 26 16:41:00 EDT 2011 | scottp
Here's what I do: - Test Surface Insulation Resistance (we're in the high reliability market and use a test significantly harder than IPC's). I also test SIR in combination with other assembly materials like conformal coatings and wave solder flux
